Archive for the ‘CMOS Circuit Design’ Category

New PMC Module Uses Economical Spartan-6 FPGA to Reduce Cost of Complex Embedded Computing Tasks

Thursday, December 15th, 2011

New PMC Module Uses Economical Spartan-6 FPGA to Reduce Cost of Complex Embedded Computing Tasks











New PMC Module uses Spartan-6 FPGA for economical reconfigurable computing tasks


Wixom, MI (PRWEB) October 14, 2011

To assist embedded system developers with ever-tightening budget and time constraints, Acromag introduced new PMC mezzanine modules featuring the cost-optimized Xilinx® Spartan®-6 FPGA. The PMC-SLX reconfigurable FPGA modules can save thousands of dollars, yet still deliver high-performance computing for algorithm acceleration and custom logic processing tasks. Spartan-6 FPGAs have integrated logic, DSP, and memory resources that leverage the flagship Virtex-6 FPGA platform’s architecture and system-level blocks for quicker and smoother system development. Acromag adds a high-throughput PCI-X interface, large memory banks, and easy access to field I/O signals to deliver a ready-to-use FPGA computing module for advanced signal processing applications. Typical uses include hardware simulation, in-circuit diagnostics, communications, signal intelligence, and image processing. The base price is just $ 2895 with extra memory and extended temperature options available.

“The Spartan-6 FPGA is designed for cost-sensitive applications, but with abundant logic resources and high-speed DSP, it is more than capable for many mil-aero and industrial control functions” noted Rowland Demko, Acromag’s national sales manager. To optimize system performance and enable cross-platform compatibility, Spartan-6 FPGAs use an efficient dual-register 6-input LUT logic structure, built-in system-level blocks, and DSP slices derived from the high-end Virtex-6 architecture. As part of Xilinx’s targeted design platform, designers can leverage common design methodologies, development tools, and run-time platforms for greater cost savings and faster time-to-market. Likewise, Acromag’s PMC-SLX support software is very similar to their other FPGA design kits to save additional time.

Field I/O interfaces to the FPGA via the rear J4/P4 connector and/or with optional front mezzanine I/O extension modules. 64 I/O or 32 LVDS lines are accessible through the rear connector. Acromag’s plug-in AXM mezzanine cards provide additional I/O processing capabilities. A variety of these AXM mezzanine I/O cards are available to provide front-end 14-bit 105 MHz A/D conversions or an interface for CMOS digital I/O, RS-485 differential signals, or extra LVDS I/O lines.

All models employ the logic-optimized SLX150 version of the Spartan-6 FPGA which provides 147,433 logic cells and 180 DSP slices. Dual-ported SRAM (256k or 1M x 64-bit) facilitates high-speed DMA transfers to the bus or CPU. This memory provides direct links from the PCI bus and to the FPGA. 16MB flash memory enables on-board storage and loading of the FPGA code. The 100MHz 64-bit PCI-X interface ensures fast data throughput. PMC-SLX modules are ready for use in conduction-cooled systems and offer an optional upgrade to extended temperature range parts suitable for -40 to 85°C operation.

Acromag’s Engineering Design Kit provides utilities to help users develop custom programs, load VHDL into the FPGA, and establish DMA transfers between the FPGA and the CPU. The kit includes a compiled FPGA file and example VHDL code provided as selectable blocks with examples for the local bus interface, read/writes, and change-of-state interrupts to the PCI bus. A JTAG interface allows users to perform on-board VHDL simulation. Further analysis is supported with a ChipScope™ Pro interface.

For easy integration of the boards with embedded Windows® applications, Acromag developed a DLL driver software package for compatibility with Microsoft® Visual C++™, and Visual Basic. Sample files with “C” source demonstration programs provide easy-to-use tools to test operation of the module.

For real time and open source applications, Acromag offers C libraries for VxWorks®, Linux®, and other operating systems. The libraries provide generic routines (source code included) to handle reads, writes, interrupts, and other functions. Demonstration programs enable the developer to quickly exercise the I/O modules before attaching the routines to the application program. This diagnostic tool can save hours of troubleshooting and debugging. The Linux example programs are a free download.

Acromag has designed and manufactured measurement and control products for more than 50 years. They are an international corporation with a world headquarters near Detroit, Michigan and a global network of sales representatives and distributors. Acromag offers a complete line of embedded I/O and industrial computer products for military, aerospace, manufacturing, transportation, utilities, and scientific research applications.

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Vocus, PRWeb, and Publicity Wire are trademarks or registered trademarks of Vocus, Inc. or Vocus PRW Holdings, LLC.







Related CMOS Circuit Design Press Releases

SVTC, Amerimade Technology and Shanghai Sinyang Semiconductor Materials Form Partnership to Expand Advanced Electroplating Process Capabilities

Thursday, November 17th, 2011

SVTC, Amerimade Technology and Shanghai Sinyang Semiconductor Materials Form Partnership to Expand Advanced Electroplating Process Capabilities












SAN JOSE, CA (PRWEB) October 19, 2011

SVTC Technologies, the premier innovation partner for accelerating nanotechnology development and commercialization, announced today that it is partnering with Amerimade Technology and Shanghai Sinyang Semiconductor Materials to advance process development and production readiness for electroplating applications. This unique combination of engineering expertise, production knowhow, chemistry products and electroplating equipment provides customers access to advanced electroplating development capabilities supporting through-silicon via (TSV) technology and continues an ongoing SVTC strategy to create an ecosystem of partners that enables comprehensive value-added solutions for customers.

Similar to signal vias used in printed circuit boards, TSVs allow for signals to pass through the silicon substrate — a major advantage over traditional packaging and chip-to-chip interconnect schemes. TSVs enable advanced packaging technologies such as 3D IC integration where multiple chips can be stacked on top of each other for improved packaging density and improved signal performance. TSV technology is also critical for next-generation microelectromechanical systems (MEMS).

Given the advanced nature of TSV technology, many manufacturers do not have the process expertise nor tool sets required to develop the electroplated film solutions required for leading-edge devices and packaging. This partnership delivers over 95,000 square feet of state-of-the-art cleanroom, staffed 24/7, with a highly versed engineering team provided by SVTC, powered by electroplating tool sets and knowhow from Amerimade and chemical solutions from Shanghai Sinyang. In addition to providing manufacturers access to these vital technologies, this partnership focuses on developing new electroplating processes.

“SVTC is committed to providing our customers with the most innovative nanotechnology development and commercialization services for next-generation devices,” said Wilbur Catabay, Vice President Technology Solutions for SVTC Technologies. “Working with both Shanghai Sinyang and Amerimade Technology will help our customers accelerate process development and demonstrate production readiness for 3D IC and MEMS technology.”

The genesis of the partnership arose from each partner’s long-standing familiarity with the other’s experience, capability, competence and success in their respective business areas. Customers can expect to receive a broad range of solutions from process demonstrations to a robust commercialization process that can take an idea, demonstrate its value as a proof of concept, and then drive the capability of its processes and integration to production readiness.

“Our technology partnership with SVTC represents an outstanding combination of Amerimade’s many years of success with the engineering and manufacturing of electroplating equipment for the semiconductor, MEMS, data storage and life science markets, with SVTC’s compelling concept-to-commercialization business model and Shanghai Sinyang’s chemical expertise,” said Mark Blaze, VP of Customer Operations from Amerimade Technology. “We believe the partnership will have immediate and positive impact on our customers’ ability to rapidly and successfully develop and adopt electroplating solutions for their products.”

SVTC Technologies provides a complete range of solutions through in-house capabilities and a network of service and production partners. Based on years of hands-on, collaborative experience, SVTC continues to assemble an ecosystem of valued partners that provides a full complement of specialized services and enables a broad array of technology development capabilities.

About Shanghai Sinyang Semiconductor Materials:

Shanghai Sinyang Semiconductor Materials Co., Ltd is a leading-edge technology company, concentrating on research and development, design, and manufacturing of advanced chemicals for the electronics industry. The company is mainly involved in electronics, semiconductor manufacturing, packaging test and assembly, solar cell manufacturing and avionics. Shanghai Sinyang is focused on chemical solutions supporting through-silicon vias, micro-bumping, MEMS, solar cells and other wafer-level plating. The company also develops ultra-pure materials and chemicals for wafer-level wet processes such as photoresist stripping and cleaning. More information can be found at http://www.sinyang.com.cn.

Media Contact:

Shanghai Sinyang Semiconductor Materials

Wenyan Zhi

VP – Marketing & Sales

wenyan_zhi(at)sinyang(dot)cn

+86 138-0198-2015

About Amerimade Technology:

Amerimade Technology Inc. designs, manufactures and provides long-term field support for an expansive array of wet chemical processing systems. Based in Livermore, CA, Amerimade applies 20 years of experience to deliver equipment solutions that meet the unique needs of every customer, whether manual systems for R&D, or fully automated systems for high volume production and processes, including plating (electrolytic and electro-less, single element and alloy, magnetic and non magnetic), wet etching, stripping, cleaning, pattern develop, electro-etch and electro-polish. Industries served include semiconductor, MEMS, data storage, life sciences and PV solar. Amerimade provides compatibility with the complete range of SEMI-standard wafers as well as virtually all other substrates and devices requiring wet chemical processing and custom fixtures. Field support is provided through Uptime Semiconductor Equipment Services, our wholly-owned services division. More information can be found at http://www.amerimade.com.

Media Contact:

Amerimade Technologies, Inc.

Mark Blaze

VP – Customer Operations

mark.blaze(at)amerimade(dot)com

925-243-2305

About SVTC:

SVTC Technologies provides development and commercialization services for innovative semiconductor process-based technologies and products, cost effectively and in an IP-secure manner. Through facilities in San Jose, California and Austin, Texas, SVTC serves customers in rapidly growing markets such as MEMS, microfluidics, high voltage, and TSV that are used in a wide array of industries such as semiconductor fabrication, life science, aerospace and defense, consumer mobility and clean energy. SVTC offers a suite of leading-edge equipment and services, including full-scale 8-inch and 12-inch process capabilities, advanced CMOS and non-CMOS equipment, analytical services, development support tools and commercialization services. SVTC is ISO 9001, ISO 13485 and ITAR registered. SVTC’s investors include Oak Hill Capital Partners, Tallwood Venture Capital and the company’s management and employees. SVTC is an equal opportunity employer. More information can be found at http://www.svtc.com.

Media Contact:

SVTC Technologies

Rich Brossart

Sr. Director of Marketing

Rich.Brossart(at)svtc(dot)com

408-240-7252

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Vocus©Copyright 1997-

, Vocus PRW Holdings, LLC.
Vocus, PRWeb, and Publicity Wire are trademarks or registered trademarks of Vocus, Inc. or Vocus PRW Holdings, LLC.







More CMOS Circuit Design Press Releases

CMOS Multi-num? America thresholds: loss of power management

Tuesday, September 14th, 2010

DescriptionOver of the latest product? Re d? Decade, the r? Reduction of switching power dynamic? T? the main objective in most technical about? circuit are low power. ? this? era, the power of flight? the? state blocked? a? t? No? negligible compared? dynamic power. However, as the? Scales of technology in the r? Regime deep? Submicron tion, increased leakage power can no longer? Be n? Gliga?. See you soon t, s largest? So that SoC designers must r? Solve is the fact that transistor circuits m? Memory num? America and will be more. . . More>>

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Sunday, September 12th, 2010

Product DescriptionIn of 20 search res ann? Es, programmable logic circuits have? T? rapidly developed. However, the intrinsic constraints? Questions such as volatile? given for? es and leakage currents? lev? s CMOS technology because of limits increasingly, as the loss given? are where power outages, long p? latency period for initializing the system ? me and high? energy in standby mode, etc. This last point has become one of? so important for minimizing the transistors below 90 nm. R? Recently, many technologies? Emergent have bee. . . More>>

Hybrid Spin / CMOS circuit design and analysis: Design, of the? Evaluation, simulation and implementation? Implement hybrid circuits spin CMOS /

Circuit design int? Gr? Num s? America: CMOS VLSI architectures for manufacturing

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Output circuits are ubiquitous DescriptionVLSI that appear in the modern world, and the design of her? Is effectively more difficult with the d? Development of ever-smaller chips. This manual ax? Practice covers the major aspects of VLSI design using a top-down approach, which reflects? you the mani? circuits which re num? America are actually stupid? us. Using tips and advice? Case studies and lists of controlled? It, this comprehensive guide to knowing when and how the design of VLSI circuits, includes benefits. . . More>>

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Design of Low Power CMOS DeltaSigma low voltage A / D converters

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DescriptionDesign produces low voltage low power CMOS Sigma-Delta A / D? Feasibility studies the? design Delta-Sigma analog converters-num? America for the supply voltage tr? low (lower? Interior? 1. 5V) and low power operation in the proc? d? s standard CMOS. The technique chosen is the setting? To implement Switched Opamp technique that pr? Sees operating Switched capacitor? low supply voltage without the n? stop? applying multipliers or voltage devices VtMOST low. A m? Method of. . . More>>

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100 times faster transistor d? Development of new carbon-speed-del? amorphous-silicon RFID, semiconductor components, the transistor carbon – printing

Monday, September 6th, 2010

A temp? Perature technology semiconductor manufacturing equipment, such as billboards? Be electronic (electronicbillboards) that the applications? large? scale, and? RFID labels can? be disposable applications ultra-low-cost as possible. But most of the transistors of the temp? Perature the mobility? of? electrons is very? s low num? America only one per cent per volt cm ^ sec (cm2/Vs).? Now, Georgia Institute of Technology (Georgia Institute of Technology, Georgia Tech), the researchers say gr? what? the use of carbon-60 (C60) film Ball Buck (Fuller? ing) or Fuller? ties (Fuller? ing) to make transistors (transistor) channel (channel) is? a ratio of amorphous silicon can be brought product (amorphous)? temp? room temperature? 100 times faster m? Methods of manufacture of transistors.? “We do pr? Not hold out? Be the first? Make the C60 transistors in the laboratory of the temp? Temperatures;? Professor GeorgiaTech BernardKippelen ad? Undeclared: ? The innovation of our R & D r? results is to prove that the process? temp? room temperature and obtained a 3 ~ 5cm2 / Vs such great mobility?? electronic, but may also have good stability? renewable (reproducibility?), low threshold voltage and high switching ratio (report offcurrent). “? global research laboratory? temp? ambient temperature in technology to take advantage of low prices, the? p? e Disaster Yao? efficient? Printing technology Oll-to-roll) printing ink jet or cr? First major? Notches and applications? low co? t such that RFID products; this her? it, you do not need these expensive clean room, the treatment process? high temp? temperature. But there are many fa? Ons trying to use mati? Res organic transistors, but also essay? using the formula for finding new mast? rials for am? the mobility improves? of? electrons in the channel.? other unit? s research has reached more? lev? that the mobility? of? electrons GeorgiaTech group? study, but mostly? through the process? high temp? temperature for? Made? with transistors. While the industry am? Rican has developed an inorganic silicon ink Kovio (inorganicsiliconink) can? Be manufactured?’re Using thin film transistors inkjet printing, but? Temp? Erasure process is much more? Lev? the plastic substrate could afford.? Despite? the r? results GeorgiaTech R & D, non-r? realization proc? d? ? high temp? temperature mobility can reach? of? electrons (Kovio says his mobility? of? electrons and polysilicon as good), they reach the mobility? of? electrons that amorphous silicon? t?. Potential applications of technology as a means of production requires that the rate refreshed? Ciated 16 ms (refresh) the display of the service (for display), they can use plastic substrates? low co? t? continued improvement of the design over the last? res ann? are based on, Kippelen says his Team from research identi? the n? stop? a low temp? temperature? high mobility? of? electrons optimize matt? rials and settings: station:? Our research is low? e on refining organic semiconductors (purification) and the treatment is based on several Sch? are the exp? experience. while the di? electric grid (gatedielectric) and the choice of m? tal to? electrode, but? also play an r? the important. “? Georgia Tech Professor Bernard Kippelen (center)? Temp? Ambient temperature on the transistor and research projects of? Development and research? At the school and BenoitDomercq Zhang Xiao-Hong, a PhD candidate? Work together .? Concern for convenient?, GeorgiaTech component mod? the d ‘? team has been constructed? in the silicon substrate, but the researchers affirm? their use of organic transistors C60 all? s? tions are r? alis? s? temp? ambient temperature. Transistors used? s for? electrode m? tal? temp? ambient temperature, it is used? with? OLED screen and plastics used? s in solar cells transparent? Way (transparentprocess ) d? position made the m? me technology.?? Our? electrode is the use of masks (shadow masks) and the? thermal evaporation (thermalevaporation) process, in the highlight of organic semiconductors ; Kippelen ad? Undeclared:? Gr? this? source m? tal (source) and between the substrate to keep sufficient distance (three feet), allows the substrate can? be whatever they want r? e as overheating process of d? p? t? Then the researchers? students making N-channel and P channel transistor means, enjoy the temp? perature of contents? res organic, manufacturing display? Active matrix for CMOS inverters (inverters), ring oscillator (ringoscillator), logic gate and entered? ment auxiliary circuit, etc.. “Replacing the silicon with a plastic floor, but also our future share research project Kippelen said.? However, the heat? Not manufacturing transistors using C60 or there is a d? Savantage is that they are sensitive? the oxygen? not mean that the components must work in an environment of nitrogen. The researchers plan to re-form a mole? cle of Fuller? do, and in her? one component of vacuum packaging r? solve the problem? me.

Nanometers? Triques CMOS VLSI Circuits: Design of fabricabilit?

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Lumi? St and infrared radiation in the system? My vid? Osurveillance

Thursday, September 2nd, 2010

Over the last? Res ann? Are we assist? ? the appearance of the journ? e cam? flush night surveillance, all dowry? are a “miracle” capacity? ? amplified by several hundred folds of the cam? ra “minimum illumination” by the removal of IR filter and? dyeing circuit color. Usually, the sensitivity? mode varies from day one? 0 lux. 25 lux and jumps? 0. 01 ~ 0. 0001 lux for the night of the camera (B / W) mode. This “miracle” increase is not true, it is a measuring device by exposing the CCD (Charged Coupled Device)? High power ‘? mission infrared pr? cisant wrong? value tr? s low lux. Lux and the infrared power are not the m? My. Lux is a unit? photometer? metric that measures the point? point? lighting (depending on the quantity? the light for irradiated? e and the distance between the light source and object? clear?) while the infrared power is a unit? Radiom? cudgel – measured? e Watts. Enlightenment, it is possible for us to see any infrared radiation is invisible? the human eye. The distinction between? Lighting and infrared radiation in the en? Sequences, or the wavelength. The wavelength of the visible spectrum s’? Tends 400 nm (violet)? 700nm (red) which is divided into a rainbow of colors from red? orange? yellow? green to blue and violet. CIE (International Commission on Illumination) also known as the International Commission for the? Lighting, clearly indicated? measuring the light? re, known as the photometer? sorts, only applies? the visible light spectrum and includes common? s such as slow light? re, candle and lux. Measurements of the man ‘? He d? Protection capacity? showed? the efficiency? is the most? lev? e? color green (100%? about 555 nm) and it decreases? 50% pr? S Orange (about 610 nm) and blue (about 510 nm) and less than 10% pr? S red (around 650 nm) and violet (around 470 nm). The? Human beings can not feel waves radiated? Are in the ultraviolet (below 400 nm) or infrared (sup? Interior? 700 nm) r? Regions. ICE standards are quite complex, but suffice to understand that the value of a source the light for green (555nm) with 1W Lumen is? scabies? 683 lumens, which from a point of measuring point is? Scabies? 683 Candela. In contrast, 1W red (650 nm) light output is? Gal? only 68 and 68 candela lumen and 1W-infrared (700 nm) light radiant flux? re is? scabies? 0, 0 and 0 lux candela. The problem? Me is that few people know what lux and infrared radiation are, or how? Lighting and radiation are measured? S. One device for measuring the? Lux lighting is the? Clearly m? Very,? Also known as a photometer? Be. The meter the light for includes a filter and is stallions? to measure only unit? s the light for the visual spectrum of optics such as? finished by the CIE. This filter is similar to the IR cut filter emp? Loved one to pass infrared radiation in order to maintain the pr? Measurement accuracy. That’s why all the counters of known exposure luxm: station and? Lighting of the? Equipment Measuring read or 0 lux? an r? sidual when exposed to infrared radiation. In CCTV m station with light? Re are used? S to measure the illumination of the sc? Not observed? E by a cam? Ra of the container dimensions, but should never? Be used? to measure the infrared radiation, because its reading will be 0 lux, or r? SIDU as 0. 001 lux, whereas the sc? Can? Be expos? ? of quantity? s whatever they want saddles of infrared radiation. To understand tr? Full well the impact that these measures? design a system? CCTV me we must first understand how a CCD (Charged Coupled Device) works. The CCD is stupid? U to like? human eye, with colors similar to? protection of effectiveness?. Therefore, the CCDs are more sensitive to green (550 nm) r? Region of the spectrum and decrease the sensitivity? ? 0 in the ultraviolet (400 nm) r? Region. CCDs, however, no longer feel the infrared and 700nm? 1000nm (some are more sensitive and can d? Detect up? 1200nm). The sensitivity? CCD is much lower in the r? IR region and efficacy? fall? only 5-10% or less, as the chart shows typical CCD performance. M? Me if the efficiency? d? sensor protection in the r? infrared region is very? s low during the journ? e infrared radiation which is strongly radiated? e by the sun, hot objects, the human body or incandescent? halogen? should? be emp? ch? s to reach the CCD color. If IR is radiated? E in the optical path of a color CCD, it disruptive heavy processing images in color. Therefore, all the colors (or CMOS) sensor is CCD? Very? Quip? an IR cut filter that blocks infrared radiation to reach. As explained? above, the sensors are much less sensitive to infrared radiation that the visual spectrum. By stupid? Fore, the notion that the suppression of anti-IR filter increases the sensitivity? the apparatus of a hundred or a thousand times is a simple case of the distortion induced by wrongful use of a photometer? be to measure the infrared radiation. The common test inaccurate for the night mode of a cam? Ra Day / Night is performed? by introducing a powerful infrared radiator (improperly call? e IR illuminator) to the infrared radiation on a si? sank. The test is r? Alis? connecting a cam? ra CCTV (with IR cut filter removed? e)? a waveform analyzer to measure the output signal. The cam? Ra day / night is placed? to observe a si? do infrared irradiated? s. Apr? S that posem? Is positioned be? On e si? Not to measure the infrared radiation in lux. This is a test that misleading g? N? Of re r? Erron results? S. We will obtain an IR-induced B / W signal in the waveform analyzer with a value such as 20 IRE, while posem? Very read 0 lux or an r? Sidual as 0. 01 ~ 0. 0001 lux, which is used? in the data sheet of the camera? finish the sensitivity? or his? minimum lighting. You? Be aware that the IRE is a unit? signal level or strength and is not associated? ? infrared radiation in any fa? it. Good, but more “? Hard evidence” school of sensitivity? a cam? ra surveillance or? minimum lighting is performed? in pla? ant a standard source 2000 lux with a focus in front of the cam? ra (religious?? analyzer waveform) with IR cut filter removed?. Apr? S the initial registration are ins? R?’re Facing source the light for up? the signal vid? o measured? e fall? 20 IRE. The? Minimum lighting of being very calculating? on a factor of r? reduction of the density? neutral density filter. Neutral density filters are available in diff? Different factors of transmission and r? Reduce the intensity? light by ratios such as?, 1 / 16, 1 / 50, 1 / 100 etc. The density filters? are very neutral? s like? those used? s in the objectives? auto iris? chip. That’s why whenever you see one cam? Ra day / night with? Minimum lighting values as 0. 001 lux or 0 m? Me. 001 lux, try to keep? one thing in mind – the strat? gies marketing, sometimes more weight than common sense.

Aarkstore company stock-Switch fabric market, strategies, forecasts, market studies Aarkstore-Enterprise

Monday, August 30th, 2010

Switch Fabric market share, Strategies, and Forecasts, Worldwide, 2010 2016able Contents: SUMMARY FABRIC SWITCH-ES 1Switch fabric market driving forces 6Time ES-multiplexing (TDM) Time-Slot Interchange (TSI) Switch Fabric market share 8Ethernet ES-Switch Fabric Market Shares ES-9Packet Fabric Market Shares ES-11Switch fabric market forecasts ES-121. Switch Fabric Market Description and Market Dynamics 1-11. 1 Multi-Service Provisioning Platform 1-11. 1. A switching fabric and network topology 1-21. 1. Two switch fabrics for consumer electronics 1-21. 1. 3 Wi-Fi in mobile devices 1-31. 1. Multimedia Centre 4 1-41. 1. 5 coexistence and interference 1-51. 2 Size and cost of components 1-61. 3 Environment Industry Switch Fabric 1-61. 3. An integrated communications CircuitEvolution introduced by the Internet 1-101. 3. 2 Transmission of digital broadband 1-101. 4 1-112 converged networks. Fabric Switch: Market shares and market forecasts 2-12. 1 Switch Fabric Market Driving Forces 2-12. 2 Time Division Multiplexed (TDM) Time-Slot Interchange (TSI) Switch Fabric Market Shares 2-42. 3 Ethernet Switch Fabric Market Shares 2-62. 4 Activities Packet fabrics market 2-82. 5 Packet Fabric ASIC Market Shares Owner 2-102. 6 Some profiles of market participants 2-112. 6. A PMC – Sierra 2-112. 6. 2 Broadcom 2-112. 6. 3 2-122 SMAC. 6. Broadcom switching 2-122 4. 6. 5 Dune Networks market-leading Merchant Switch Fabric 2-122. 6. 6 Networks Dune 2-132. 6. 7 Speed 2-142. 6. 8 GigaStream Chip Set Vitesse Semiconductor 2-152. 6. Chip Set 9 Speed TeraStream 2-152. 6. 10 Marvell Prestera-FX9210 fabric CrossbarSwitch 12-Port 2-162. 6. 11 Erlang Network Element Technology (ENET) Xe System ™ Fabric Switch 2-162. Switch Fabric Market Forecasts 7 2-172. 8 Data Center 2-192. Carrier 9 and 2-202 service provider. 10 Enterprise 2-202. 11 Home and Small Business 2-212. Cloud Computing Enterprise 12 2-212. 13 data centers cloud 2-262. 13. Cloud Computing a Buzz 2-292. Instrumented 14 digital cameras 2-312. 15 scalable symmetric multiprocessing 2-322. 15. 1 Cloud Computing Systems Database Management 2-332. 15. 2 Building a robust sensor data integration layer network 2-382. 16 Switch Fabric Market Segments Regional 2-382. 16. 1 Switch Fabric Market Participation Regional 2-393. Description of Fabric switches 3-13. 1 Speed 3-13. 1. 1 Speed Chip Set GigaStream ® is a high performance synchronous Fabric Switch 3-13. 1. 2 Speed 80 Gbps fabric swithces Intelligent Queuing Engine 3-43. 1. 3 GigaStream of Vitesse Semiconductor Chip Set 3-133. 1. 4 Speed TeraStream chips 3-143. PMC Sierra PM5376 TSE 2 ™ Nx160 switching element transmission 3-153. 3 applies 3-163 Micro. 3. 1 PRS AppliedMicro 5G/C48X Fabric Switch Device 3-193. 3. 2 AMCC PRS switch fabric family designed in Nortel MPE platform 3-303. Broadcom 3-313 4. 4. A Broadcom 24-port 10-GbE and 4-Port Switch Gigabit Ethernet Multilayer 3-333. 4. 2 Fabric Switch Broadcom BCM56720 3-343. 4. 3 Fabric Switch Broadcom BCM56720 3-383. 4. Broadcom BCM56820 4 – 24-Port 10-GbE and 4-Port Gigabit 24-Port Multilayer EthernetSwitch 10-GbE switch and a 4-port Gigabit Ethernet multilayer 3-423. 4. Broadcom Ethernet Switch Fabric 5 3-483. 4. Broadcom BCM88130 six high-performance fabric Switch 3-513. 4. 7 Broadcom ™ 4-Port Switch Multi 10-GbE/HiGig + 3-613. 4. 8 BroadcomBCM56511 integrates sophisticated advanced L3 switching 3-673. 4. 9 Classification BroadcomContentAware 3-683. 4. 10 BroadcomBCM56511 Integrated Security Functions 3-683. 4. Broadcom BCM56511 11 meters Incorporates sophisticated statistics and 3-683 of traffic management. 4. Broadcom Dune Networks 12 / 3-693. 4. Broadcom 13 / Dune 3-703. Broadcom 5 3-713. 5. Broadcom a metropolitan area networks and wide 3-763. 6 Marvell 3-783. Key 7 processor Marvell Prestera-DX Features 3-803. 7. 1 Marvell Prestera-EX Enterprise Multi-Layer Switching Packet Processors 3-823. 7. 2 processors Marvell 12-Port Fabric Fabric crossbar 3-833. 7. 3 Marvell Prestera-FX9210 Fabric 12-Port Switch through 3-843. Fujitsu Micro 8 3-843. 8. 1 CX4 compared to other technologies 3-913. Fulcrum Microsystems Switch 9 Ethernet router FocalPoint chip family 3-963. Integrated Device Technology 10 3-993. 10. 1 Family Integrated Device Technology Manager Traffic 3-1013. 11 Atera 3-1023. 11. Positioning a Switch Fabric Atera 3-1023. 11. Altera Stratix GX 2 Fabric Switch System 3-1033. 11. Altera three centralized switching matrices 3-1043. 12 Fabric Switch Erlang 3-1103. 13 Erlang Components Fabric Switch 3-1113. 13. 1 Performance Erlang and attack detections ¨ C 3-1153. 13. 2 Erlang blocking 3-1173. 13. 3 Fabric Switch Technology Erlang element network (ENET) Sei-CSIXTM 3-1223. 13. 4 Technology Erlang element network (ENET) Xe System ™ Fabric Switch 3-1243. 14 Fabric Switch Software 3-1293. 15 3-1293 SMAC. General Description 16 3-1304. Fabric Switch STRATEGY, TECHNOLOGY AND APPLICATIONS Industry Specific 4-14. 1 Level Nano CMOS Integrated Circuits Broadcom 4-14. 2 Upgrading the HD video experience with a MoCA home network by 4-14. 2. 4-24 Evolution of a home network. 3 Multimedia over Coax Alliance (MoCA) 4-34. Cost 4 attractiveness Ethernet 4-65. Change Profile FABRIC COMPANY 5-15. 1 Cisco Systems Inc. (NASDAQ: CSCO) and Juniper Networks (Nasdaq: JNPR) 5-15. 5-15 AppliedMicro fév. 2. 1 Energy Efficient processors AppliedMicro 5-25. 2. 2 Power Architecture SoC AppliedMicro 5-35. 2. Micro 3 applies the second quarter of fiscal 2010 revenues of 5-45. Broadcom 3 5-45. 3. 1 Innovation Technology Semiconductor Broadcom 5-45. 3. 2 Broadcom’s intellectual property (IP) 5-65. 3. 3 5-65 Broadcom income. 3. 4 broadband modems and residential gateways Broadcom 5-165. 3. 5 Customers Broadcom 5-175. 3. 6 Broadcom digital cable, direct broadcast satellite and IP set-top High 5-225. 3. 7 Platform Broadcom silicon upscale Interactive decoders, Supporting SimultaneousViewing television 5-235 With Internet content. 3. 8 DBS Broadcom Broadcast Solutions 5-235. 3. 9 Broadcom satellite market broadband 5-235. 3. 10 Broadcom Solutions IP Set-Top Box 5-245. 3. Broadcom DTV 11 5-245. 3. 12 companies Broadcom DTV Advanced Micro Devices 5-245. 3. 13 Broadcom High Definition Blu-ray Disc 5-245. 3. 14 Broadcom LAN network 5-255. 3. 15 processors Broadcom Wi 5-265. 3. Broadcom Dune Networks 16 / 5-265. 3. 17 Switch Fabric Chipset Dune 5-265. 4 Technology Erlang 5-275. Integrated Device Technology 5 5-285. 5. 1 Revenue Fujitsu 5-335. Fulcrum Microsystems 6 5-335. 6. Fulcrum Microsystems a Nexus ® through 5-345. 6. Fulcrum Microsystems RapidArray 2 Memory ™ Packet 5-355. 6. 3 Integrated Device Technology, Inc. revenue 5-365. 6. 4 Integrated Device Technology, Communications Sector 5-385. 6. 5 Integrated Device Technology, computing and consumer segment 5-385. 6. Integrated Device Technology 6 regional income 5-385. 6. 7 Integrated Technology communication device segment 5-405. 6. 8 Integrated Device Technology Telecommunications Products: 5-425. 6. 9 integrated technology and computer peripherals 5-435 segment of consumers. Mindspeed 7 5-525. 7. 1 Mindspeed Technologies Semiconductor Solutions Networking 5-545. 7. 2 Mindspeed signal conditioning products 5-565. 7. 3 Price and availability Mindspeed Technologies 5-585. 7. 4 Mindspeed (R) 5-585 fiscal 2008 revenue for the fourth quarter. 7. 5 Strategy Mindspeed 5-615. 7. 6 Customers Mindspeed 5-645. 7. 7 Mindspeed capitalized on the extensive portfolio of integrated products 5-645. Netlogic Microsystems 8 / Aeluros Inc. 5-66 5. 8. 1 Information NetloFor more, please contact: http://www. aarkstore. com/reports/Switch-Fabric-Market-Shares-Strategies-and-Forecasts-Worldwide-2010-to-2016-37935. html