Posts Tagged ‘Chip’

SMARTCODE Corp. announces the world’s smallest RFID chip

Tuesday, October 11th, 2011

SMARTCODE Corp. announces the world’s smallest RFID chip










(PRWEB) January 16, 2004

SMARTCODEÂ? Corp., the leading developer of low cost RFID tags and readers, announced today the world’s smallest RFID Integrated Circuit (IC). The announcement took place at the The National Retail Federation (NRF) 93rd Annual Convention, at the Jacob. K. Javits Convention Center in New York City. The new RFID Integrated Circuit with a die size of 0.25 mm2 delivers the best price/performance in the RFID industry.

Designed for a wide range of RFID applications, including Wal Mart, the US Department of Defense, Tescoin the UK, and the Metro Group in Germany, this next-generation IC saves valuable silicon space in its design while maintaining the highest RF efficiency. SmartCode Corp. supports EPCglobal’s EPC Class 1 standard and will support C1V2 once standardization completes.

“We are very happy to introduce the world’s smallest and the best cost effective RFID Integrated Circuit in the industry.Â? Said Roy Apple, SmartCodeÂ? Corp Vice President, Â?From the early stages of low cost RFID, SmartCodeÂ? Corp. continues its leadership in this market by introducing new and innovative solutions to reach a true cost effective RFID. As a world leader in low cost RFID market, we are delighted to witness the strong support from both retailers and governments, as well as from complimentary world leading technology vendors, further demonstrating the true value of low cost RFID.”

The new RFID IC is developed using CMOS (Complementary Metal-Oxide Semiconductor) technology. Today, CMOS technology is the dominant semiconductor technology for microprocessors, memories and application specific integrated circuits (ASICs). The main advantage of CMOS over NMOS and bipolar technology is the much smaller power dissipation. Unlike NMOS or bipolar circuits, a CMOS circuit has almost no static power dissipation. Power is only dissipated in case the circuit actually switches. This allows to integrate many more CMOS gates on an IC than in NMOS or bipolar technology, resulting in much better performance. Production of the new RFID IC is expected to begin in Q4 2004.

The new RFID IC, combined with SmartCode Corp.’s Flexible Area Synchronized Transfer (FAST) mass production manufacturing technology provide a best of its class tag manufacturing capabilities, catering to the massive global demand for low cost RFID.

Until toady, the prices of RFID tags of an average of 50 cents, have created a cost barrier for companies worldwide to adopt the RFID solution as the replacement of the inefficient barcode technology. With SmartCodeÂ? Corp.Â?s exclusive patented manufacturing technology, SmartCodeÂ? Corp. can manufacture these RFID tags at a price level of 5-10 cents, in large volumes.

For additional information visit: http://www.smartcodecorp.com

About SMARTCODE CORP.

SmartCodeÂ? Corp. is a leading RFID developer that has developed a revolutionary, patented, and cost effective RFID manufacturing technology. Our Patented technologies enable us to intelligently replace the current inefficient Barcode technology. Our patented technologies enables us to manufacture a very large number of RFID tags at a fraction of the cost of today’s traditional RFID. SmartCodeÂ? Corp. introduces a cost-effective approach to dramatically reducing our clients Total Cost of Operation (TCO) and increasing their Return On Investment (ROI). SmartCodeÂ? Corp. enables companies to receive 100% real time visibility of their products across their entire supply chain. SmartCodeÂ? Corp. is headquartered in Tel-Aviv, Israel, with offices in New York, NY and London, UK.

Forward looking statements

Statements in this press release that are not historical facts, including those statements that refer to The SmartCodeÂ? Corp.Â?s plans, prospects, expectations, strategies, intentions, hopes and beliefs, are forward-looking statements. These forward-looking statements are based on information available to SmartCodeÂ? Corp. today, and SmartCodeÂ? Corp. assumes no obligation to update these statements as circumstances change. There are risks and uncertainties that could cause actual results to differ materially from the forward-looking statements, including, without limitation, market acceptance of our technologies, the competitive nature of our market, SmartCodeÂ? Corp. ability to retain and increase revenue from existing clients and to execute agreements with new clients, and SmartCodeÂ? Corp.Â?s ability to attract and retain qualified personnel.

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Vocus©Copyright 1997-

, Vocus PRW Holdings, LLC.
Vocus, PRWeb, and Publicity Wire are trademarks or registered trademarks of Vocus, Inc. or Vocus PRW Holdings, LLC.







Kilopass Introduces 90-nanometer Standard CMOS Embedded Non-volatile Memory Technology for Secure Storage of System Firmware and Chip IDs

Monday, August 22nd, 2011

Kilopass Introduces 90-nanometer Standard CMOS
Embedded Non-volatile Memory Technology for Secure Storage of System Firmware and Chip IDs










(PRWEB) October 21, 2004

XPMÂ?s process scalability, low cost, high density & data security

key to customer acceptance

Santa Clara, CA ARM DevelopersÂ? Conference Â? October 19, 2004 Â? Kilopass Technology, Inc., an emerging supplier of embedded non-volatile memory (NVM) Intellectual Property (IP) based in Santa Clara, California, today announced that its XPM technology is now available for use in ASICs and SoCs using standard logic CMOS 90 nanometer silicon processes in addition to its current products utilizing 0.18, 0.15, and 0.13 micron processes.

XPM, a unique embedded one-time-programmable (OTP) NVM technology, offers the combination of scalability to advanced silicon processes such as 90 nanometer, low standard logic CMOS fabrication cost, storage density from a few bits to up to multiple mega bits and highly secure storage. With its complete range of bit sizes and its wide variety of applications XPM can enhance almost any chip design.

Dr. Jack Peng, CEO, Kilopass Technology, noted, Â?We have shipped our patented XPM technology to over a dozen customers, and are very pleased to announced that we have tested and verified silicon, in 90 nanometers, with 1,000 hours of burn-in, and that our customers expect to move from silicon prototypes to high volume manufacturing in the next few months.Â?

As a replacement for external memory chips XPM technology can be used in high density embedded memory applications for publishing games, movies and other multimedia content, as well as for secure firmware storage in embedded MCU and DSP-based systems. XPM can also be used for secure ID and data storage for smart cards, for embedded ID and parameter storage, for storing encryption keys, for analog trimming and calibration parameter storage, for storing unique configuration codes and for embedded memory repair.

More about XPM Technology

XPMÂ?s patented fuse-programmable technology uses 1.5 transistors per memory cell, is programmable with a low program current by either an external or internal voltage source, and offers a fast read access time of 40nsec ~ 70nsec (for 1Mbit, 0.18 micron process).

Applications requiring more than one-time programming can use a multiple sector approach with a minimal die area penalty. For example sizing up from 1K bits of XPM-based memory to 8K bits offers eight sectors for limited-time re-programmability and it adds a negligible amount of die area.

XPM Memory Technology Reliability & Security

XPM technology is highly secure. Data is permanently retained for the life of most systems (over 20 years), and is protected from reverse engineering, since it is not possible to detect the stored data with a microscope or by voltage contrast testing.

Availability

Licenses for XPM memory technology are available now, and include GDSII layouts as well as simulation and timing models.

About Kilopass

Kilopass Technology, Inc. was founded with the mission of becoming the industry leader in embedded non-volatile memory (NVM) technology. The CompanyÂ?s super-permanent memory technology is manufactured using standard commercial CMOS process, and is used for storage of firmware and security codes.

The company is headquartered at 3333 Octavius Dr. Suite 101, Santa Clara, CA 95054, USA

For more information, please visit http://www.kilopass.com, call (408) 980-8808 or email klptinfo@kilopass.com.

# # #

Acronyms

ASIC    Application Specific IC

CMOS    Complementary Metal Oxide Silicon

DSP    Digital Signal Processor

IC    Integrated Circuit

ID    Identity

IP    Intellectual Property

MCU    Micro Controller Unit

NVM    Non Volatile Memory

OTP    One Time Programmable

SoC    System-on-a-chip

A white paper and data sheet are available on request.

XPM is a trademark of Kilopass Technology, Inc.

All other trademarks and tradenames are the property of their respective owners.



















Vocus©Copyright 1997-

, Vocus PRW Holdings, LLC.
Vocus, PRWeb, and Publicity Wire are trademarks or registered trademarks of Vocus, Inc. or Vocus PRW Holdings, LLC.







Related CMOS Layout Press Releases

Domestic Chip Bottleneck Breakthrough Paves the Way for China’s 3G Launch – Comlent samples World’s 1st CMOS TD-SCDMA Transceiver

Wednesday, April 6th, 2011

Domestic Chip Bottleneck Breakthrough Paves the Way for China’s 3G Launch – Comlent samples World’s 1st CMOS TD-SCDMA Transceiver











SHANGHAI, China (PRWEB) October 30, 2006

Comlent Technology Inc., the only Radio Frequency Integrated Circuit (RFIC) corporate member of China’s 3G standard TD-SCDMA Industry Alliance (TDIA), announced today that it starts sampling RFIC transceiver and analog baseband (ABB) chipset in advanced CMOS technology for TD-SCDMA, the world’s first in its kind.

The chipset includes a single chip transceiver CL4020 that uses a direct-conversion architecture that integrates the voltage-controlled oscillator (VCO), fractional-N phase-locked loop (PLL), a receiving channel select filter and a transmit driver amplifier and an analog baseband (ABB) chip CL4520 that uses digital signal processing (DSP) to compensate for the imperfections in the analog channel-select filter and to perform dc-offset cancellation. The transmit channel achieves the root mean square (RMS) of the error vectors, EVM, of less than 4%. The phase locked loop integrated phase noise from 1KHz through 640KHz achieves 0.85 degree and noise figure of whole receiving channel is below 4dB, to name a few performance indicators. The testing was conducted in “Agilent-Comlent TD-SCDMA RF Labs”, the only such RF testing lab for TD-SCDMA in Asia. Nearly a dozen inventions have been disclosed during the development of this chip set. Most of them are being filed for patents in both China and the US.

Before this, TD-SCDMA transceivers provided by two foreign companies were both BiCMOS technology based and cover only one of the two allocated frequencies (1880MHz-1920MHz and 2010MHz-2025MHz) to TD-SCDMA in China. CL4020 is world’s first dual-band CMOS TD-SCDMA transceiver that also lifts China’s final bottleneck of domestic TD-SCDMA equipment and chip supplying chain. RF transceiver has been identified as the bottleneck of domestic industrial base by China for both TD-SCDMA and other modern wireless communications.

Comlent, established in Shanghai Zhangjiang Hi-tech Park in 2002 as the first and currently leading RF and mixed signal IC design house in China, has built a hybrid team of local fresh talent combined with experienced overseas expatriates, CMOS RF and SoC design capability, market channel and strong local government support from ground up. Comlent has been the only RFIC transceiver chip vendor sponsored by Chinese 3G national research grants as well as the only RFIC chip vendor in TD-SCDMA Industry Alliance (TDIA) since April 2006 through a very selective process.

“In the past 4 years, Comlent has envisioned and executed a unique “local plus mobile” strategy. The cornerstone of this strategy is to focus on enabling however cost effective chip solution for explosive wireless and broadcasting consumer markets in China”, stated Dr. Kai Chen, co-founder and CEO of Comlent, “Following two trends lend Comlent strong support and leverage. On the one hand, China has become the global manufacturing center of consumer electronics. On the other China has drafted and is implementing a series of national standards such as 3G mobile communications (TD-SCDMA vs. CDMA2000 in the US), Digital TV (DMB-T/H and STiMi vs. DVB-H in Europe) and satellite global positioning system (Beidou or CNSS vs. GPS in the US)”, continued Dr. Kai Chen, “To better equip Comlent to benefit most from the opportunities, Comlent has strategically evolved and transformed itself from a BiCMOS based RF only company when started four years ago into a CMOS based RF, mixed signal and digital SoC company”.

“RF transceiver chip has been identified and considered the bottleneck for China’s domestic wireless communication industry that hindered the China 3G (TD-SCDMA) deployment in the past 2 years”, stated by Mr. Hua YANG, the general secretary of China’s TD-SCDMA Industry Alliance (TDIA), “Comlent’s selection into TDIA and achievement in sampling RF transceiver for TD-SCDMA removes one of major concerns in the dawn of TD-SCDMA launch”.

“Comlent’s 3G transceiver design is very indicative of rapid acquaintance of high end chip design capability by China based design houses in recent years”, commented by Dr. Datong Chen, the co-founder and CTO of Spreadtrum Communications, “The fact that Comlent brings world class CMOS RF and SoC design capability to local opens wide opportunity for baseband chip suppliers such as Spreadtrum to more closely and strategically team up with to benefit from exponential growth of personal mobile and multi-media platform markets in China and elsewhere”.

As world’s largest mobile handset market, China’s total number of mobile subscribers has exceeded 431 million in June with annual growth of approximately 50 million according to China Ministry of Information Industry (MII). China also manufactures world’s most mobile handsets for both domestic and oversea markets. According to MII, China in 2005 manufactured approximately 290 million mobile handsets, or over 40% of world’s projected total handset output in the year.

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Vocus©Copyright 1997-

, Vocus PRW Holdings, LLC.
Vocus, PRWeb, and Publicity Wire are trademarks or registered trademarks of Vocus, Inc. or Vocus PRW Holdings, LLC.







Find More CMOS Error Press Releases

Be a Part of Billion Dollar Business – Chip Designing Made Easy

Monday, February 21st, 2011

Introduction


The word of Chip designing means building an integrated Chip, by integrating billions of transistors to achieve an application. An Application could be suiting a particular requirement like Microprocessor,Router,cell phone,etc. An Integrated circuit designed for a specific application is called as ASIC(Application Specific Integrated Circuits).


Todays ASIC Chips is prettly complex packed with larger chunk of transistors targetted to a specific manufacturing process for fabricating the integrated circuits, in a sub nanometer regime, involving lots and lots of challenges, like knowledge of various protocols, architectures, models, formats, standards, knowledge about CMOS logic, Digital Design concepts, taming the EDA tool for the various design requirement’s like area, timing, power, thermal, noise, routability, lithography aware, knowledge about Various variabilities like channel length, Vt, line width variations, lens abrreations, IR drop effects,inter-die, intra die-variations, effects, and various noise-effects like Package noise,EMI noise,power grid noise,cross-talk noise and ability to test and validate and know to model and characterize all these effects upfront in the design-phase,steps to increase yield to increase profitability curve, with short span of time-to market to minimize the risk and maximize the predictability and an modular approach to Success. Now let’s dwelve in to the “Art of Chip Designing”


Used lot of Technical Jargons, nothing to worry about we will get in there soon…Be with me promise you understand the Concepts behind Chip Desiging.

Before Designing a Chip? Need to Brain Storm


1. What market the Chip is targetted for?

2. What are the Protocols involved in the Chip?

3. What is going to be our Processor/Bus Architecutes?

4. what is the power/IR-drop/timing/Area/Yield/ targets and how to budget it in the Chip?

5. What is the process in which the Chip going to be manufactured?

7. what are the various third party IP’s/Memory requirements?

8. what is our Design flow and EDA tools and methodology involved?

9. What is the estimated Chip Cost?

10. Above all the bottom line of any business model is money, What will be our Profit model ,estimation of our ROI(Return of investment).


To know the Concepts of Chip Desiging,FREE Access!!!
www.vlsichipdesign.com

Analogy of Chip Design Architecture Vs Building Architecture


Why an Analogy with Building Architecture,It is just to understand the concepts of Chip desiging in a better way, as we are very familiar with Building Architecture, then it will be easy for us to map Chip Design architecture.


VLSI(Very large scale Integration) flow was evolved similar to the flow involved in Building Construction.Now let us dwelve in to the constuction flow to better understand the VLSI Chip design flow development.


When ever we start to construct a building, we will have an architecture, how the building should look like , the exterior looks and all, similar to that we will be designing an architecture in the chip-design, based on the requirement of the product, what the product is addressed for and whom to serve what needs, the so called specification, will having the modules.


Now lets go in to the implementation part of both the Building & Chip.


We at first come with the floorplan of the building, similarly we come with the floorplan of the Chip, Based on the connectivity/accessibility/vaasthu we place our rooms, similarly we have the constraints to place the blocks. Like we build the building with bricks, for Chip Design we have libraries, which are like pre-designed bricks, for a specific functionality.


Now let us try to understand the power-structure or electrical connectivity in our Building. Initially we have an Electrical plan for our building, where we have a requirement that all our electrical gadgets needs to get power. Similar to that we have a Chip power requirement, The required power is supplied through the power-pads, over a ring like topology to have a uniform distribution across all corners of the chip, and the supply has to reach all the standard-cells(bricks for Chip-Designing).,this is called as power-grid topology in the Chip-Design, now the requirement is how well we design our Power-grid, to reduce the IR-drop so that our standard-cells get proper power requirement.


I would not make justice, if I dont discuss about clock and clock-tree in the Chip-Design flow. We have synchronous way of designing and asynchronous way of designing(difficult to verify). Majority of chips follow Synchronous way of coding, for which Static Timing Analysis is possible. For the relevancy of the flops the clock to those flops should reach at the same time from the crystal, with in some skew targets with in the chip.In order to make this happen, a step called as clock-tree is performed after power-grid is created.


Let us try to visualize the concept behind Place & Route in Chip Design. We need to undergo lot of modelling concepts, to understand the process of Chip-Designing. To have a better understanding of this concept of place and route, let us assume a society where people who are speaking different languages are living , and let us visualize that people talking of the same languages are living in a community, then the communication is much easier , similar way in the chip-designing, the standard-cells who are having design relation-ships, are placed closer in the Placement flow this concept is called as regioning. Now with in the regioning, of the groups of the standard-cells, the cells which are really sharing data, has to placed close-by so that there timing is achieved and well optimized.This step is called placement, Connectivity across the standard-cells is called as routing, the challenge is having optimized or reduced wire-lengths.


Now let us try to try to understand the concept behind signal integrity in the Chip-Design , often called us SI Effect. As our process is shrinking day by day, and our silicon-realestate is costly, we try to accommodate more and more standard-cells in the limited area, so the cells are placed in very close proximity, so the switching of one can have an impact over the others behaviour, which can make the path to be faster or slower, this issue is called as signal-integrity. So similar way in our construction in order to maintain the integrity with in the house(neighbour free-zone), within the limited zone of modurality, we try to create fences, across buildings, similarly we can think of a concept called as Shielding, the high frequency signal net with the power-nets running across. We perform spacing across the buildings, similar way we can perform spacing across the nets, which are in close proximities.


In order to validate the silicon from the manufacturability issues, the concept in the Chip Desigining is Design for Test(DFT). One of the DFT techniques is scan-chain. To understand the concept of the scan-chain, we can visualize that we have a front-door entry and a back-door exit, and a person passes from the front-door and exits from the back-door exit of the building, that we are sure that there is no blocking within the rooms in the building, to make that person stuck , similar to this analogy the flip-flops are connected to-gether creating a scan-chain and test-input values are passed from the scan-chain input of the chip and expected data is visualized in the scan-chain output of the chip, then the assumption is the chip is free from manufacturability issues like stuck-at faults(stuck-at one or stuck at zeros).


To know the Concepts of Chip Desiging,FREE Access!!!
www.vlsichipdesign.com

Chip Design Veteran


Article from articlesbase.com

By Ahmed Abu-Hajar, Ph.D. Lecture one, presents CMOS Devices that are used in ANALOG “Electroncs” Design.

Signetics 1977 microprocessor chip Philips announces Print page 2 -

Thursday, September 9th, 2010

  • Original vintage magazine advertisement print
  • Page size approx 8 1/4″ x 11 1/4″.
  • Unique gift
  • Decorative collectible

Original vintage print product DescriptionAn magazine ad ann? E publication. The printed ads?’re Making unique gifts that can? Be formul?’re Like work of art. Free Shipping? ? dish of the UN? frame plastic sleeve with board support. . . . More>>

Signetics 1977 microprocessor chip Philips announces Print page 2 -

Himfr. com reports AMD will change the marketing strategy, emphasis was placed on the chip

Monday, August 30th, 2010

AMD, according to foreign media reports recently said that preparing for a change in the past Bipin performance with Intel’s marketing strategy, has decided to focus on improving the users understanding of their own chips. Over the years, AMD was the CPU speed on the most important item to consider, but the company said today focus more on marketing the speed of the processor on the chip, but more focused on how they affect the computer at work. Vice-president of global marketing Leslie Sobon AMD, said in an interview, the user must know the technical details of the microprocessor, for them, even more important is the adoption of the chip, the computer can process any task. And this idea of a new marketing strategy should be published on Thursday, was named “Vision”. The industry assumes that Intel microprocessors with the war years of the competition, AMD failed to obtain an advantage, it may change AMD’s marketing strategy to promote true reason. It seems that people in the industry, AMD would probably communicated to the market from AMD and Intel battle has been defeated. Between 2003 and 2006, three years, AMD has worked with Intel, Bipin performance, but was unable to obtain advanced, in addition to its own advantage, Intel, AMD’s own implementation also contributed to his inability to gain the upper hand in competition due to the 1. At the same time, Intel is also moving with Ling (Atom) processor in the Internet access to opportunities in this market, AMD is on the market a few. However, a few years ago AMD bought ATI is still spending huge sums of its existing strengths. Chupin, the company is not only high-performance graphics chips, but also supports the high quality video content. AMD executives say that the current value of the user is becoming increasingly multi-media performance, also the corresponding general performance of the microprocessor have been neglected. AMD said: “The most favorable situation for us.” The new marketing strategy should help AMD to Intel to regain market share. Because AMD chips designed by the benefits to users more powerful and attractive. To Intel, the brand is too complex to allow a large puzzle. Even if Intel had in June this year, the brand has been simplified, and retained only the Atom, Celeron, Pentium 4 and Core brand, but for their own products, said the company would continue to be conducted in accordance with different technical requirements for promotion. U.S. research firm Endpoint Technologies Associates analyst Roger Kay, AMD could undermine the technology and to help customers choose the right products, who will win the PC makers of all ages. He said, AMD can be through a new marketing campaign to inform customers which products are suitable for watching normal video, which, to watch videos in high definition, and are suitable for the production of high-definition video. It is reported that Intel plans to launch later this year for laptops and smart Arrandale Clarksdale, Larrabee chip in the next version. puce Larrabee will include multiple heart graphics processing capabilities integrate with the x86 architecture, improving application and graphics performance. The chip is likely to be called the GPU, mainly for market high-end gaming and the need for parallel processing and graphics capabilities of the industry’s market, such as oil and gas exploration. But anyway, many experts analyzed that, AMD, after changing the marketing strategy of Intel yet as soon as possible to regain market share.

Microprocessor architecture: From Pipeline Single Chip Multiprocessor

Sunday, July 25th, 2010

Product DescriptionThis book gives a full description of the architecture of microprocessors simple drawings to short pipeline outside Superscalar order. It covers topics such as: – policies and mechanisms for out-of-order processing such as file renaming, reservation stations and reorder buffers – for high performance optimizations such as branch predictors, instruction scheduling, and design choices speculation load-store – and enhancem. . . More>>

Microprocessor architecture: From Pipeline Single Chip Multiprocessor

Be a part of the industry a billion dollar chip design

Wednesday, April 28th, 2010

Introduction Word of the chip design is to build an integrated chip, the integration of billions of transistors to achieve an application. An application can be suitable for a particular requirement, such as microprocessor, router, cell phone, etc. An integrated circuit designed for a specific application is known as ASICs (Application Specific Integrated Circuits). Today’s prettly complex ASIC chips is packed with larger pieces of transistors for a specific manufacturing process for the manufacture of integrated circuits in nanometer regime, involving many, many challenges, such as knowledge of various protocols, architectures, models, formats, standards, knowledge of CMOS logic, digital design concepts, EDA tool for taming the region, such as requiring different design, timing, power, heat, noise, routability, lithography consciousness knowledge of variability such as different channel length, Vt, variations in line width, the objective abrreations, IR drop effects, inter-die, intra-die variation, effects and various noise effects such as noise packaging, EMI noise, noise from the mains, crosstalk noise and the ability to test and validate information and to model and characterize all the effects of the initial design phase, measures to increase the yield curve to increase profitability, with short time to market to reduce risks and maximize the predictability and a modular approach to success. Now we dwelve in the “Art of Chip Design” Used a lot of technical jargon, nothing to fear, we will soon. . . Be with me promise to fully understand the concepts behind Chip desiging. Before designing a chip? Need Brain Storm 1. What is the market for the chip is scheduled for? 2. What are the protocols involved in the chip? 3. What will be our manufacturing / Architecutes Bus? 4. What is the power / IR-drop / time / area / performance / objectives and how to budget in the chip? 5. What is the process in which the chip will be built? 7. What are the requirements of various third IP / memory? 8. What is our design flow and EDA tools and methodology in question? 9. What is the estimated cost smart? 10. Above all, the bottom line of any business model is money, what will our profit model, the estimation of our ROI (Return on Investment).

The chip design for Submicron VLSI: CMOS Layout and Simulation

Tuesday, April 27th, 2010

Product DescriptionThe text is organized around the introduction of the first global view of digital integrated circuit design, VLSI design automation and then successively develop the themes from the level of materials and devices, through the circuits, then at the system level. This reflects the hierarchical structure of the field of chip design itself. While building a solid foundation and reference for chip design, he joined the discussion with hands on examples of design automation. . . More>>

The chip design for Submicron VLSI: CMOS Layout and Simulation

Be part of a Billion Dollar Business – Chip Design Made Easy

Sunday, April 25th, 2010

Introduction Word of the chip design is to build an integrated chip, the integration of billions of transistors to achieve an application. An application can be suitable for a particular requirement, such as microprocessor, router, cell phone, etc. An integrated circuit designed for a specific application is known as ASICs (Application Specific Integrated Circuits). Today’s prettly complex ASIC chips is packed with larger pieces of transistors for a specific manufacturing process for the manufacture of integrated circuits in nanometer regime, involving many, many challenges, such as knowledge of various protocols, architectures, models, formats, standards, knowledge of CMOS logic, digital design concepts, EDA tool for taming the region, such as requiring different design, timing, power, heat, noise, routability, lithography consciousness knowledge of variability such as different channel length, Vt, variations in line width, the objective abrreations, IR drop effects, inter-die, intra-die variation, effects and various noise effects such as noise packaging, EMI noise, noise from the mains, crosstalk noise and the ability to test and validate information and to model and characterize all the effects of the initial design phase, measures to increase the yield curve to increase profitability, with short time to market to reduce risks and maximize the predictability and a modular approach to success. Now we dwelve in the “Art of Chip Design” Used a lot of technical jargon, nothing to fear, we will soon. . . Be with me promise that you understand the concepts behind Chip desiging. Before designing a chip? Need Brain Storm 1. What is the market for the chip is scheduled for? 2. What are the protocols involved in the chip? 3. What will be our manufacturing / Architecutes Bus? 4. What is the power / IR-drop / time / area / performance / objectives and how to budget in the chip? 5. What is the process in which the chip will be built? 7. What are the requirements of various third IP / memory? 8. What is our design flow and EDA tools and methodology in question? 9. What is the estimated cost smart? 10. Above all, the bottom line of any business model is money, what will our profit model, the estimation of our ROI (Return on Investment). For the concepts of Chip desiging, Free! Www. vlsichipdesign. comAnalogy Chip Design Architecture Vs Building Architecture Why an analogy with the architecture of buildings, it is fair to understand the concepts of Chip desiging a better way, as we are very familiar with building architecture, then it will be easier for us to chip design architecture. VLSI (very large scale integration) has evolved flow similar to flow involved in the construction of buildings. Now, let us dwelve in the flow of construction in order to better understand the VLSI chip design flow development. Whenever we start to build a building, we have the architecture, how the construction should look like, and all outward appearance, similar to what we will develop an architecture of the chip-design, based on the requirement of the product, which product is addressed, for whom and what to serve the needs, the specification itself, will have the modules. Now go in the implementation of both the building & Chip. We first came up with the plan of the building, so we arrive with the plan of the chip, the basic connectivity / accessibility vaasthu we place our rooms, just as we have constraints placed blocks . As we build the brick building, for Chip Design, we have libraries, which are like pre-designed blocks, for a specific feature. Now try to understand the power structure or the electrical connectivity in our building. Initially, we plan for our electric building, where we have an obligation to all our electrical needs for power. Similar to what we need in power chip, the power required is supplied by the power pads on a ring topology as to have uniform distribution in all corners of the chip and supply must reach all types of cells (bricks to-Chip Design). , This is called topology of power grids in the chip-design, now the requirement is how we design our network-Power, to reduce IR-drop for our standard cell requirement to obtain adequate nutrition. I would not do justice if I did not discuss the clock tree in the flow of chip design. We develop synchronously and asynchronously design (difficult to verify). Most chips monitor synchronously coding, for which the static timing analysis is possible. For the relevance of the flops of the clock to reach those flops along the crystal, in certain objectives through the chip. To do this, a step called clock-tree is performed after the grid is created. Let us try to visualize the concept behind the Place & Route Chip Design. We need to undergo a lot of modeling concepts, understand the process of chip-design. To get a better understanding of the concept of place and route, we assume a society where people who speak different languages are alive, and let us imagine that people speak the same language live in a community, then communication is much easier, much like the chip-design, standard cells that have the design of relations, are placed closer to the flow of investment this concept is known as regioning. Now, in regioning, groups of standard cells, cells that are actually sharing data, placed near by so that the schedule is made and well tuned. This step is called placement, connectivity between the standard cells is known as routing, the challenge is to be optimized or reduced wire lengths. Let us now try to understand the concept behind the integrity of the signal in the chip-design, we often called SI effect. As the process is decreasing day by day, and our silicon realestate is expensive, we try to accommodate more and more standard cells in the restricted area, so that the cells are placed very close, so that the transition one can have an impact on the behavior of others, which may make the path to be faster or slower, this problem is known as signal integrity. Thus, similar in construction to maintain our integrity in the house (near the zone) in the restricted area modurality, we try to create fences, in buildings, so one can think of a concept called the shield, the net high frequency signal with the power of crossing nets. We realize the separation between buildings, similarly, we can make the spacing between the nets, which are in close proximity. To validate the silicon manufacturability issues, the concept of the smart card is Desigining design for test (DFT). One technique is the DFT scan-chain. To understand the concept of chain analysis, we can see that we have an entrance door and an exit door, and a person moves from the entrance and exits from the outlet the rear door of the building, we are sure that there is no blockage in the rooms in the building, to make that person trapped, like that analogy the flip-flops are connected in-seems to create a scan chains and test input values are passed from the scan chain input of the chip and expected data is displayed in the output scan chain of the chip, the chip is assumed to be free from manufacturability problems such as stuck at faults (stuck at one or stuck at zero). For the concepts of Chip desiging, Free! Www. vlsichipdesign. com