Posts Tagged ‘Chip’

Matsushita Electric Chip microprocessor 1980 Ad Print page 2 -

Friday, April 23rd, 2010

  • Original vintage magazine advertisement print
  • Page size approx 8″ x 11 1/2″.
  • Unique gift
  • Decorative collectible

DescriptionAn vintage print ad original product magazine of the year of publication. Print ads make unique gifts that can be framed as artwork. Shipped flat from the UN-frame plastic sleeve with board support. . . . More>>

Matsushita Electric Chip microprocessor 1980 Ad Print page 2 -

Be A Part Of The Billion Dollar Chip Design Industry

Wednesday, April 21st, 2010

Introduction The word of the chip design is to build an integrated chip, by integrating billions of transistors to achieve an application. An application can be favorable, a specific requirement such as microprocessors, routers, cell phones, etc. An integrated circuit designed for a specific application is known as ASIC Application (Specific Integrated Circuits). Today’s ASIC Chips prettly complex is packed with larger pieces of transistors for a specific manufacturing process for the manufacture of integrated circuits in a sub nanometer regime, involving many, many challenges, such as knowledge of various protocols, architectures, models, formats, standards, knowledge of logic CMOS Digital Design Concepts, tame the EDA tool for the region as the requirement of differential design, timing, power, temperature, noise, routability, lithography knowledge, knowledge of variability such as different channel length, Vt, variations in line width, lens abrreations, the effects of IR drop, inter-die, intra-die variation, effects and various combinations of sound effects such as noise package, EMI noise, grid noise, noise Cross talk and his ability to test and validate and learn to model and characterize all these effects at the initial stage of the design phase, measures to increase the yield curve to increase profitability, with a short time-to-market to minimize risk and maximize the predictability and a modular approach to success. Now we dwelve yourself to art “Chip Design” Used a lot of technical jargon, no fear, we will soon. . . Be with me promise you understand the concepts behind Chip Desiging. Before designing a chip? Need Brain Storm 1. What the chip market is expected? 2. What are the protocols involved in the chip? 3. What will be our manufacturing / Architecutes Bus? 4. what is the power / IR-drop / time / area / performance / targets and how the budget of the chip? 5. What is the process in which the chip will be built? 7. what are the third different requirements Memory IP /? 8. This is our design flow and EDA tools and methodology in question? 9. What is the estimated cost smart? 10. Above the bottom line of any business model is money, this will be our profit model, estimation of our ROI (Return on Investment).

1977 Philips Signetics Microprocessor Chip 2-Page Print Ad

Monday, April 19th, 2010

  • Original vintage magazine advertisement print
  • Page size approx 8 1/4″ x 11 1/4″.
  • Unique gift
  • Decorative collectible

Product DescriptionAn original vintage magazine ad print from the year published. Print ads make unique gift items that can be framed as artwork. Shipped flat un-framed in plastic sleeve with backing board. . . . More >>

1977 Philips Signetics Microprocessor Chip 2-Page Print Ad

Join the Billion Dollar Business – Chip Design Made Easy

Tuesday, March 30th, 2010

Introduction The word of the chip design is to build an integrated chip, by integrating billions of transistors to achieve an application. An application can be favorable, a specific requirement such as microprocessors, routers, cell phones, etc. An integrated circuit designed for a specific application is known as ASIC Application (Specific Integrated Circuits). Today’s ASIC Chips prettly complex is packed with larger pieces of transistors for a specific manufacturing process for the manufacture of integrated circuits in a sub nanometer regime, involving many, many challenges, such as knowledge of various protocols, architectures, models, formats, standards, knowledge of logic CMOS Digital Design Concepts, tame the EDA tool for the region as the requirement of differential design, timing, power, temperature, noise, routability, lithography knowledge, knowledge of variability such as different channel length, Vt, variations in line width, lens abrreations, the effects of IR drop, inter-die, intra-die variation, effects and various combinations of sound effects such as noise package, EMI noise, grid noise, noise Cross talk and his ability to test and validate and learn to model and characterize all these effects at the initial stage of the design phase, measures to increase the yield curve to increase profitability, with a short time-to-market to minimize risk and maximize the predictability and a modular approach to success. Now we dwelve yourself to art “Chip Design” Used a lot of technical jargon, no fear, we will soon. . . Be with me promise you understand the concepts behind Chip Desiging. Before designing a chip? Need Brain Storm 1. What the chip market is expected? 2. What are the protocols involved in the chip? 3. What will be our manufacturing / Architecutes Bus? 4. what is the power / IR-drop / time / area / performance / targets and how the budget of the chip? 5. What is the process in which the chip will be built? 7. what are the third different requirements Memory IP /? 8. This is our design flow and EDA tools and methodology in question? 9. What is the estimated cost smart? 10. Above the bottom line of any business model is money, this will be our profit model, estimation of our ROI (Return on Investment). For concepts Chip Desiging, free! Www. vlsichipdesign. comAnalogy Chip Design Architecture Building Vs Why an analogy with the building’s architecture, it is fair to understand the concepts Chip desiging a better way, as we are very familiar with the architecture of the building, then it will be easy for us to chip Architecture Design. VLSI (Very large scale integration) flow has evolved similar to the flow involved in construction. Now, let us dwelve in the flow of construction in order to better understand the design of VLSI chip development cycle. Whenever we begin to construct a building, we have an architecture, how the building should look like, looks outside and all, like the one we will develop an architecture of the chip-design, based on the requirement the product, the product is sent to and used that needs the specification itself, whose modules. Lets go to the party implementation of both the building and Chip. We first came with the floor plan of the building, and we come with the floorplan of the chip, based on connectivity / accessibility / vaasthu we place our rooms, so we have the constraints place the blocks. As we build the brick building for Chip Design, we have libraries, which are like pre-designed blocks for a specific functionality. Now try to understand the power structure or power connectivity in our building. Initially, we plan our building’s electrical, we have a requirement that all our electrical needs to get power. Similar to that we need a smart power, the power required is supplied by the power pads on a ring topology as to have a uniform distribution in all corners of the chip and supply must reach all standard cells (bricks to-Chip Design). It is called as power network topology in Chip-Design, now the requirement is how we design our Power-grid to reduce IR-drop, so that our level of requirement of obtaining cells ‘adequate food. I would not do justice if I did not participate in discussions on the clock and clock-tree in the Chip-Design Flow. We synchronous design and the asynchronous design (hard to verify). The majority of the bulleted follow synchronously coding, for which Static Timing Analysis is possible. For the relevance of flops the clock to those flops should be at the same time from the crystal with an angle with certain objectives in the chip. To do this, a stage known as a clock-tree is performed after power grid is created. Try to visualize the concept behind Place & Route in Chip Design. We need to undergo many modeling concepts, understand the process of design-CHIP. To get a better understanding of the concept of place and route, we assume a society where people who speak different languages are alive, and let us imagine that people speak the same language live in a community, then communication is much easier, even in the so-piece design, standard cells that have the field of ship design, are placed closer to the stream of investment of this concept is known as regioning. Now, in the regioning, groups of standard cells, cells that are actually sharing data, placed close by so there timing is well done and optimized. This step is called placement, connectivity between the standard cell is known as the routing, the challenge is to be optimized and reduced wire length. Let us now try to understand the concept behind the signal integrity in chip-design, we have often wondered IF Effect. As the process is narrowing day by day, and our silicon realestate is expensive, we try to accommodate more and more standard-cells in the limited area, so that the cells are placed in very close proximity, so the transition from one can have an impact on the behavior of others, which may make the journey to be faster or slower, this number is known as signal integrity. So alike in our construction to maintain integrity in the house (near the zone), in the limited area of modurality, we try to create fences, around buildings, so one can think of a concept Shielding known as the net of high frequency signal with the power running through the nets. We make the spacing between buildings, the same way we can make the spacing between the nets, which are in close proximity. To validate the silicon manufacturability issues, the concept in Desigining Chip is design for test (DFT). One technique of DFT is scan-chain. To understand the concept of the chain analysis, we can see that we have a first entry door and a door emergency exit, and a person moves from the entrance and exits from the rear exit door of the building that we are sure that there is no blockage in the rooms in the building, to make that person stuck like this analogy, the flip-flops are connected in-creation seems ‘channel scan and test input values are transmitted from the digital input channel of the chip and the expected data is displayed in the scan-chain output of the chip, then the assumption is the chip is free of problems in manufacturability as stuck faults (stuck at one or stuck at zero). For concepts Chip Desiging, free! Www. vlsichipdesign. com

New chip cooling technology

Thursday, March 25th, 2010

According to Moore’s law on the density of chips in microprocessors keep doubling every two years. With increased density and efficiency of current chips on the amount of heat generated by these chips is also increasing. To cope with the enormous heat, new technologies will be needed in future to cool the integrated chips that produces much more heat than current microprocessors. This new technology was developed at Purdue University that uses “micro” to deposit liquid into tiny channels. This technology can remove five times more heat than other experimental high-performance chip cooling methods. The conventional computer chips typically generates about 100 watts per square centimeter. The chips are air-cooled with finned metal plates called heat sinks and often a small CPU fan. Most of the liquid cooling techniques are limited to a cooling capacity of about 200 watts per square centimeter. However MicroJet new technology is able to cool chips that produce over 1000 watts of heat per square centimeter. With the doors of its new aid to the advancement of chip technology can be opened. This technology is a combination of two methods of cooling, the microjets and microchannels, which is called a hybrid system. The microjets cools evenly because the liquid is delivered in the form of jets everywhere along the length of each channel. It helps to prevent some of the chips from overheating. The coolant is collected at each end of channels and is circulated back through the system. The channels of the cooling system is narrower than one millimeter, or one thousandth of a meter wide. They are trained over a chip covered with a metal plate. This metal plate is tiny holes through which coolant is pumped in microjets, and the liquid flows along channels to cool the chip. When the coolant is heated by the hot chip inside the channels, it bubbles and becomes a vapor, facilitating the cooling process. This new technology that uses a hydrofluorocarbon coolant. It is a dielectric and will not conduct electricity or cause short circuits. However hydrofluorocarbons are not liquid cooling and highly efficient thermal conductivity is much lower than water. But they avoid short circuits and are environmentally better than other coolants. They have weak effects of global warming and are not harmful to the ozone layer in Earth’s atmosphere.

Chip Design for Submicron VLSI: CMOS Layout and Simulation

Monday, March 16th, 2009

Product DescriptionThe text is organized around introducing the first global view of the design of digital integrated circuits, and VLSI design automation, and to develop sequentially from the subjects of materials and devices level, through the circuits and and system level. This reflects the hierarchical structure of the field of chip design itself. While building a solid foundation and reference for chip design, it integrates the discussion with hands on examples of design automation. . . More>>

Chip Design for Submicron VLSI: CMOS Layout and Simulation