Seek Out the Best Possible Targets for your Adwords Placement Campaigns Easily. . . Take Your Direct Link Campaigns to Market Fast with Unique Tracking IDs with the Unique Built In Placement Url Formatting Tool! Affiliates Earn 60% Commissions!
Placement Intelligence – Google Placement Targeting Made Easy!
Posts Tagged ‘Made’
Placement Intelligence – Google Placement Targeting Made Easy!
Saturday, July 2nd, 2011155 Ready Made Niche Oriented Adsense Websites. . .
Sunday, April 24th, 2011Affiliates, Accept this nice deal to promote 155 ready made adsense websites. High conversion Good Commission. Just send 100 quality visits and check your earning. Guaranteed highest conversion compared to other products.
155 Ready Made Niche Oriented Adsense Websites…
Be a Part of Billion Dollar Business – Chip Designing Made Easy
Monday, February 21st, 2011Introduction
The word of Chip designing means building an integrated Chip, by integrating billions of transistors to achieve an application. An Application could be suiting a particular requirement like Microprocessor,Router,cell phone,etc. An Integrated circuit designed for a specific application is called as ASIC(Application Specific Integrated Circuits).
Todays ASIC Chips is prettly complex packed with larger chunk of transistors targetted to a specific manufacturing process for fabricating the integrated circuits, in a sub nanometer regime, involving lots and lots of challenges, like knowledge of various protocols, architectures, models, formats, standards, knowledge about CMOS logic, Digital Design concepts, taming the EDA tool for the various design requirement’s like area, timing, power, thermal, noise, routability, lithography aware, knowledge about Various variabilities like channel length, Vt, line width variations, lens abrreations, IR drop effects,inter-die, intra die-variations, effects, and various noise-effects like Package noise,EMI noise,power grid noise,cross-talk noise and ability to test and validate and know to model and characterize all these effects upfront in the design-phase,steps to increase yield to increase profitability curve, with short span of time-to market to minimize the risk and maximize the predictability and an modular approach to Success. Now let’s dwelve in to the “Art of Chip Designing”
Used lot of Technical Jargons, nothing to worry about we will get in there soon…Be with me promise you understand the Concepts behind Chip Desiging.
Before Designing a Chip? Need to Brain Storm
1. What market the Chip is targetted for?
2. What are the Protocols involved in the Chip?
3. What is going to be our Processor/Bus Architecutes?
4. what is the power/IR-drop/timing/Area/Yield/ targets and how to budget it in the Chip?
5. What is the process in which the Chip going to be manufactured?
7. what are the various third party IP’s/Memory requirements?
8. what is our Design flow and EDA tools and methodology involved?
9. What is the estimated Chip Cost?
10. Above all the bottom line of any business model is money, What will be our Profit model ,estimation of our ROI(Return of investment).
To know the Concepts of Chip Desiging,FREE Access!!!
www.vlsichipdesign.com
Analogy of Chip Design Architecture Vs Building Architecture
Why an Analogy with Building Architecture,It is just to understand the concepts of Chip desiging in a better way, as we are very familiar with Building Architecture, then it will be easy for us to map Chip Design architecture.
VLSI(Very large scale Integration) flow was evolved similar to the flow involved in Building Construction.Now let us dwelve in to the constuction flow to better understand the VLSI Chip design flow development.
When ever we start to construct a building, we will have an architecture, how the building should look like , the exterior looks and all, similar to that we will be designing an architecture in the chip-design, based on the requirement of the product, what the product is addressed for and whom to serve what needs, the so called specification, will having the modules.
Now lets go in to the implementation part of both the Building & Chip.
We at first come with the floorplan of the building, similarly we come with the floorplan of the Chip, Based on the connectivity/accessibility/vaasthu we place our rooms, similarly we have the constraints to place the blocks. Like we build the building with bricks, for Chip Design we have libraries, which are like pre-designed bricks, for a specific functionality.
Now let us try to understand the power-structure or electrical connectivity in our Building. Initially we have an Electrical plan for our building, where we have a requirement that all our electrical gadgets needs to get power. Similar to that we have a Chip power requirement, The required power is supplied through the power-pads, over a ring like topology to have a uniform distribution across all corners of the chip, and the supply has to reach all the standard-cells(bricks for Chip-Designing).,this is called as power-grid topology in the Chip-Design, now the requirement is how well we design our Power-grid, to reduce the IR-drop so that our standard-cells get proper power requirement.
I would not make justice, if I dont discuss about clock and clock-tree in the Chip-Design flow. We have synchronous way of designing and asynchronous way of designing(difficult to verify). Majority of chips follow Synchronous way of coding, for which Static Timing Analysis is possible. For the relevancy of the flops the clock to those flops should reach at the same time from the crystal, with in some skew targets with in the chip.In order to make this happen, a step called as clock-tree is performed after power-grid is created.
Let us try to visualize the concept behind Place & Route in Chip Design. We need to undergo lot of modelling concepts, to understand the process of Chip-Designing. To have a better understanding of this concept of place and route, let us assume a society where people who are speaking different languages are living , and let us visualize that people talking of the same languages are living in a community, then the communication is much easier , similar way in the chip-designing, the standard-cells who are having design relation-ships, are placed closer in the Placement flow this concept is called as regioning. Now with in the regioning, of the groups of the standard-cells, the cells which are really sharing data, has to placed close-by so that there timing is achieved and well optimized.This step is called placement, Connectivity across the standard-cells is called as routing, the challenge is having optimized or reduced wire-lengths.
Now let us try to try to understand the concept behind signal integrity in the Chip-Design , often called us SI Effect. As our process is shrinking day by day, and our silicon-realestate is costly, we try to accommodate more and more standard-cells in the limited area, so the cells are placed in very close proximity, so the switching of one can have an impact over the others behaviour, which can make the path to be faster or slower, this issue is called as signal-integrity. So similar way in our construction in order to maintain the integrity with in the house(neighbour free-zone), within the limited zone of modurality, we try to create fences, across buildings, similarly we can think of a concept called as Shielding, the high frequency signal net with the power-nets running across. We perform spacing across the buildings, similar way we can perform spacing across the nets, which are in close proximities.
In order to validate the silicon from the manufacturability issues, the concept in the Chip Desigining is Design for Test(DFT). One of the DFT techniques is scan-chain. To understand the concept of the scan-chain, we can visualize that we have a front-door entry and a back-door exit, and a person passes from the front-door and exits from the back-door exit of the building, that we are sure that there is no blocking within the rooms in the building, to make that person stuck , similar to this analogy the flip-flops are connected to-gether creating a scan-chain and test-input values are passed from the scan-chain input of the chip and expected data is visualized in the scan-chain output of the chip, then the assumption is the chip is free from manufacturability issues like stuck-at faults(stuck-at one or stuck at zeros).
To know the Concepts of Chip Desiging,FREE Access!!!
www.vlsichipdesign.com
Chip Design Veteran
Article from articlesbase.com
By Ahmed Abu-Hajar, Ph.D. Lecture one, presents CMOS Devices that are used in ANALOG “Electroncs” Design.
Sony HDR-FX7 0. High D? Finishing Lens 48x Wide Angle Optical Made By NWV + + Stepping Ring 62-72mm Direct Micro Fiber Cleaning Cloth
Thursday, September 16th, 2010
- High Grade 0.48x Wide Converter Lens With Macro
- Multi-Coated Japan Optics
- Includes: Wide Converter, Lens Bag, Lens Cap, Lens Bottom Cover, Stepping Ring, 10 Year USA Warranty
- Micro-Fiber Cleaning Cloth
Product DescriptionEver take a picture and did not fit? whole family in the picture? You wonder how professional photographers get an edge? Do sports together in an image? Well no more! Cr? St beautiful images with the 0. 48x wide angle lens for cameras num? Rical and cam? Scopes. 0. 48x objective will of? broaden the area of the image seen twice, giving you the possibility? cr? st beautiful images without d? place away from your subject. The wide angle lens? Minimization broadens the viewing angle by multiplying. . . More>>
Sony HDR-FX7 2. 2x HD Tele Lens Made By Optical + Stepping Ring 62-72mm + NWV Direct Micro Fiber Cleaning Cloth
Friday, August 27th, 2010
- High Grade 2.2x Telephoto Converter Lens
- Multi-Coated Japan Optics
- Includes: Telephoto Converter, Lens Bag, Lens Cap, Lens Bottom Cover, Stepping Ring, 10 Year USA Warranty
- Micro-Fiber Cleaning Cloth
Product images DescriptionCapture best distant subjects with the telephoto lens optics for cameras and digital camcorders. The 2. 2x magnification allows you to bring your subject closer while you stay where you are. The 2. 2x Tele-Converter is a front-mounting lens that provides greater telephoto reach. By adding the lens at the front of your camera, it extends the focal length and makes distant objects appear closer. Unlike digital zoom, this 2. 2x optical conversion. . . More>>
Canon 5D Mark II made by the photographer Forestwander Extreme Nature
Wednesday, August 4th, 2010Canon 5D Mark II examenJ’ai started photography with a Canon PowerShot A50. I bought the camera in 2000 because that’s when my first son was born. I do not want to miss anything, as he grew up and I had never owned a camera before. I had heard about digital cameras, but never really used one. Canon PowerShot A50 This is a mega pixel camera which has some neat features for the cameras at this time. No video or something like that, but I learned to use certain features of the camera quite easily. He was very dear to my wife and I purchased this unit as it was about $ 250 and when you’ve just married a few years and having a baby is a lot of money. This camera lasted until my son was about 5 years. I started taking him fishing and places to hike with me and we took pictures along the way when you want to hike. So we decided to drop in 2005 to go hiking and exploring in the mountains of West Virginia, when I say that I mean the mountains of the Monongahela forest. There were so many areas to see and I do not really know where to start when we started the fall of hills creek and immediately I knew I was in love with nature photography, particularly nature photography cascade. We finally made our way to the Seneca Rocks area of the Monongahela forest of the North and visited the caves of Seneca, who was a great place to visit and I have some pictures in the caves of bats and various rock formations. However, when we left I put my camera on top of the car and was organized to get our things in the car to prepare our car and inadvertently left the device over the management. We started on the road and after about half a mile I heard something about to collapse the rear of the car window. I looked in my rearview mirror and saw my $ 250 camera bouncing up and down the road and the pieces fly everywhere. It was very discouraging that we planned to go to West Virginia Spruce Knob, which is the culmination of the state. I managed to pick up the pieces of my Canon PowerShot A50 from the road and took my mind that we were not going to get more photos on our trip. It was quite disappointing, but I am convinced that the trip was not about pictures, but rather about my boy and his father to spend time together. We have therefore continued to Spruce Knob and everything up there, I decided to look at the camera and see if it could be used even if it was a pile of parts. I started getting the pieces together and believe it or not able to get the camera to turn the gear of the switch to the door of flash cards. Even if the LCD was cracked in many places it actually came and I actually was able to take pictures with this camera was literally glued together with a couple of small sticks and tape. From this point forward not only did I realize that I loved nature photography, but Canon is the best camera I have. Once I started too look at other pictures of nature waterfall on the internet, I began to hunger for a new camera. I thought I must be able to understand how they made waterfalls look so soft and silky. It gave me the anointing to save and buy a new Canon Rebel 350D in early 2006. This camera was, in my opinion the best camera that I could, although many others were far more expensive and have more features, it was the first SLR I had never held in my hand. I learned the different settings and was surprised that the opening and duration of exposure could do for the look of a waterfall or a stream. That’s when Forestwander Free Nature Photo was inspired one day walking home from work singing the gospel song “How Great Thou Art”. After getting a better camera, I realized that the appearance and the sharpness of a digital image depends not only on the body of a camera, but depends largely on the quality of the lens. That’s when I became determined to get a better lens fixed focus and made the difference in a quality objective and a better zoom. I was wondering can do better photography and if so what would it take to make the best pictures. Although I did not have the money to get a professional full-frame digital camera that I had the passion to always explore and take pictures more and more refining my skills and begin to document each shipment in detail . I knew I had to start capturing our hiking adventures in the video, but did not walk around with a camcorder. In 2007 we got a new Canon G9 which, together, a point and shoot high-quality lens with the latest video technology and audio capture part of a very small camera. This camera has the best of both worlds and allowed us to hike and take pictures of wildlife and even a great great macro floral photography. That’s when I learned that the RAW image format is the best way to learn so that I can manipulate the exposure and color in post processing. Wow Jpeg I thought was great until I experienced the benefits of image retrieval generally unusable by transforming them with professional photo of Canon. The Canon G9 is really a great little camera but it lacked detail super strong and wide as my 350D Digital Rebel could reach. For the next two years, I imagined how it would be able to hike and take pictures of high quality SLR and take a nature adventure film simultaneously with the same device. One day in late 2008, I read about Canon’s new models would be released and that this unit would combine quality Super 21 megapixel full frame Canon technology not only with high-resolution video, but video 1080p HD quality. I told myself no doubt this device would be beyond my reach, and certainly should cost $ 5,000 or more. However, I learned that this new camera can be bought for just under $ 3.500 with a high quality small-aperture f4 zoom sport has also joined damp weather resistant. This was undoubtedly the answer to all my needs and desires as a nature photographer novice adventure. After several months of planning I save the chance of a new Canon 5D Mark II and accompanying 24-105mm F4 zoom. I am now the proud owner of this wonderful device for almost a year now and I am convinced that this unit is everything I need. While there may be new technologies coming out such as 3-dimensional holographic photography (think I’m kidding, watch and see). The Canon 5D Mark II camera will always be my favorite. This camera marked the camera that put me in full frame professional market. This camera takes amazing low light photography with high ISO settings, I often take low-light photography in the forest and even take some shots of night landscape mountain heights, it is imperative that the noise of these images is reduced minimum. Recently I learned that I can connect my Canon 5D Mark II to my laptop and store images directly from the camera of my 500 GB hard drive. It gives me hours of recording high quality video and thousands of images MP 21. Without doubt I have much to share with this new camera and I started to experience the wonderful quality of this device offers. So far I have posted at least 100 new ForestWander MP 21 pictures and I must say they are some of the best pictures I ever made and they keep getting better as I learn more on the 5D. The auto bracketing features are really great and help me to experience the widest range resolution with HDR. The live view function is really incredible because it allows me to develop my 5D on a tripod at ground level to a macro picture of a mushroom, for example. It would otherwise be impossible to concentrate on a small mushroom close to the ground while looking through a viewfinder. Then I can press a button and focus and see the real outcome and directly on the screen of 3 inches. This is not only very convenient to live with this but it is ideal for viewing images in post, I can literally zoom in on a particular area of a high resolution and verify that it is up to not perfect before the transfer process and the image on my laptop locally. In addition, the automatic sensor cleaning is ideal for a nature photographer who often change lenses in the area where the dust and contaminants are unavoidable. Below I have listed some of the features of the Canon 5D Mark II, but only compare the specifications of other cameras keep in mind that Canon is a great product and that their devices are robust, durable and even if other specifications on other devices that start with N are a little higher than I’ll always be a die hard fan of Canon’s real world experience that I have lived over the last 6 years as a photographer Nature aventure.Canon specifications EOS 5D Mark IIPrix (body) of the United States: $ 2,699 EU: € 2,499 in the United Kingdom: £ 2,299 Price (EF 24-105 L kit) of the United States: $ 3.499 EU: € 3.299 United Kingdom: £ 3,049 Body material Magnesium alloySensor 36 x 24 mm CMOS sensor Full 35 mm size of the RGB Color Filter Array Built-in fixed low-pass filter (with Single self-cleaning) 22. 0,000,000 total pixels 21. 1 million effective pixels 3:2 ratioLenses Canon EF mount (does not support EF-S) No field of view crop (1. 0x) reduction of dust “EOS Integrated Cleaning” cleaning unit automatically sensor (filter vibrates at high frequency from the sensor to start and shutdown – can be disabled) Dust Delete Data – Data from a test shot is used to ‘map’ dust spots and can be removed more later using Canon DPP SoftwareImage DIGIC 4A / D conversion 14 bitImage sizes (JPEG) 5616 x 3744 (21. 0 MP) 4080 x 2720 (11. 1 MP) 2784 x 1856 (5. 2 MP) Image sizes (RAW) 5616 x 3744 (21. 0 MP) 3861 x 2574 (10. 0 MP) 2784 x 1856 (5. 2MP) RAW file formats (. CR2, 14-bit) JPEG (EXIF. 2 21) – Fine / Normal RAW + JPEG (separate files) sRAW1, sRAW2 (see above) Auto focus 9-point TTL CMOS sensor 6 “Invisible Assist AF points” Centre point cross type F5. 6 or faster focus more sensitive with lenses of F2. 8 or faster AF working range: -0. EV 5-18 (at 23 ° C, ISO 100) Focus Modes One Shot AF AI Servo AF AI Focus AF micro adjustment focusAF Manual Adjust all lenses by same amount (effectively body adjustment) Adjusts to 20 goals individuallyAF selection point Automatic AF ManualPredictive Since about 8 m (with 300 mm F2. 8L lens 50 km / h) AF assist No (with external flash) Metering TTL full aperture metering 35 zone SPC measuring range: 1 . 0-20 EVMetering modes Evaluative 35 zone (linked to any AF point) partial (8% at center) Spot (approx. 3. 5% at center) Center-weighted auto-lock averageAE: One Shot AF with evaluative metering Manual: AE lock buttonExposure compensation + / -2. 0 EV 0. 3 or 0. 5 incrementsExposure EV Bracketing + / – 2. 0 EV 0. 3 or 0. 5 EV incrementsSensitivity ISO 100-6400 0. 3 or 1. 0 EV Auto ISO (100-3200) extension options: ISO 50 (L1) ISO 12800 (H1) ISO 25600 (H2) focal plane shutter Shutter 150,000 exposure durability 30 to 1 / 8000 sec 0. 3 or 0. 5 EV increments Flash X-Sync: 1 / 200 sec BulbAperture values F1. 0 – 0 F91. 3 or 0. 5 EV increments wide opening on the real objective depends on the balance Auto Daylight Shade Cloudy usedWhite Tungsten Fluorescent Flash Custom Kelvin (2500 to 10,000 K in steps of 100 K) WB bracketing + / -3 levels 3 images Blue / Amber or magenta / green change biasWB Blue (-9) to amber (+9) Magenta (-9) to Green (+9) Picture style Standard Portrait Landscape Neutral Faithful Monochrome User def. A user def. 2 User def. 3Custom image sharpness settings: 0-7 Contrast: -4 to +4 Saturation: from -4 to 4 Color tone: -4 to +4 B & W filter: N, Ye, Or thy R, G & B: N, S, B, P, Gimages your treatment options underscores the priority Auto lighting optimizer (4 settings) reduction of noise exposure along high ISO noise reduction (4 settings) Auto Correction of lens peripheral illumination ( vignetting) Color space sRGB Adobe RGBViewfinder Eye level pentaprism 98% coverage of the optical image is 0. 71x (-1 diopter with 50mm lens at infinity) eyepoint: Approx. 21 mm interchangeable focusing screen (3 other types optional) Diopter adjustment: -3. 0-1. 0 diopterMirror half mirror Quick-return (Transmission: reflection ratio 40:60) Mirror lock-up (one or multiple exposures) Viewfinder Information AF information: AF speedAperture pointsFocus informationShutter confirmation lightExposure valueISO speed (always displayed), AE level lockExposure / compensationSpot counting circleExposure informationFlash warningAEBFlash readyHigh speed syncFE lockFlash compensationImage exposure information: White balance card correctionCF informationMonochrome shootingMaximum burst (2 digit) Highlight tone priority (D +) LCD display 3. 0 “TFT LCD of 920,000 pixels Automatic 3 level brightness adjustment plus 7 manual levels 170 ° viewing angle double anti-reflection (‘Clear View’) LCD live view Live TTL display of scene from CMOS image sensor 100 % of 30 frames per second real-time evaluative metering using CMOS image sensor Best view or exposure simulation Silent Grid optional (x2), Magnify optional (5x or 10x AF point) Three AF modes – Live mode / Quick mode / Face Detection Live histogram (Luminance or RGB) Remote live view using EOS Utility 2. 0 (via USB or WiFi / Ethernet using WFT) Movie recording optional Live View mode 1920 x 1080 (16:9) up to 12 minutes (Quicktime 1080p H. 264, 38. 6 Mbits / sec) 640 x 480 (4:3) up to 24 minutes (Quicktime 480p H. 264 17. 3 Mbit / s) Max file size 4GB Quicktime MOV (H. 264 video, PCM sound) review of 30 fpsRecord Off On (histogram via INFO button) Display mode as a mode of reading used the last 2 / 4 / 8 sec / modes HoldPlayback 1. single image with exposure, file number, storage slot2. As 1 but also image count and quality3. detailed exposure information, thumbnail and luminance histogram4. Less detailed exposure info., thumbnail, luminance and RGB histogramsPlayback optional features blinking highlight alert Optional AF point display for larger image (up to 10x) 2×2 or 3×3 index Go sticker (1, 10, 100 images, screen, date, folder, movies, photos) * Remove / n ProtectFlash Integrated E-TTL II auto flash / flash meter manual compensation + / -2. 0 EV 0. 3 or 0. 5 EV increments X-Sync: 1 / 200 s Hot-shoe & PC TerminalExternal flash E-TTL II Speedlite EX series automatic in-camera flash configuration (currently only 580 EX II) Wireless PC Support multiple flash modes SyncShooting Creative Auto * Auto Program AE (P) Shutter priority AE (Tv) Aperture priority (Av) Manual (M) Custom 1 Custom 2 * 3 * Custom Drive modes single and continuous 3. 9 fps * Self timer: 2 or 10 sec (2 sec with mirror lock-up) Burst buffer Large / Fine JPEG: 78 frames (310 with UDMA card) RAW: 13 frames rotational orientation sensor YesAuto on (recorded and LCD display) On (recorded only) features 25 custom functions with 71 settings OffCustom in 4 languages groupsMenu 25 Languages English, German, French, Dutch, Danish, Portuguese, Finnish, Italian, Norwegian, Swedish, Spanish, Greek, Russian, Polish, Czech, Hungarian, Romanian, Ukrainian, Turkish, Arabic, Thai, Simplified Chinese, Traditional Chinese, Korean and JapaneseFirmware User upgradablePortrait grip optional WFT-E4 (WiFi / LAN / USB mass storage) Optional BG-E6 battery gripConnectivity USB 2. 0 Hi-Speed AV out (video & audio *) HDMI connector Microphone PC Sync flash terminal Communication terminal on base for WFT-E4 Infrared Storage Compact Flash Type I or II (inc. FAT32) Supports UDMA cards Copyright metatag support Canon Original Data Security Kit supported (“Original Image Data”) Power Lithium-Ion LP-E6 rechargeable battery (supplied & charger) CR1616 for date & settings Approx. 850 strokes at 20 ° C Battery indication 6 levels and the percentage (memorized) Dimensions 152 x 114 x 75 mm (6. 0 x 4. 5 x 2. 9 inches) Weight No battery: 810 g (1. 8 lbs) Accessories Viewfinder: Eyecup Eb, E-series Dioptric Adjustment Lens with Rubber Frame Eb, Eyepiece Extender EP-EX15, Focusing screens Eg, Angle Finder C Wireless File WFT-E4 Battery Grip BG-E6 All EF lenses (except EF-S ) Canon Speedlite (220EX, 380EX, 420EX, 430EX, 430EX II, 550EX, 580EX, 580EX II, Macro-Ring-Lite MR-14EX, Macro Twin Lite MT-24EX, Speedlite Transmitter ST-E2) Remote control with touch-type N3, Wireless Controller LC-5, RC-1, the RC-5 Original Data Security Kit OSK-E3
Be part of a Billion Dollar Business – Chip Design Made Easy
Sunday, April 25th, 2010Introduction Word of the chip design is to build an integrated chip, the integration of billions of transistors to achieve an application. An application can be suitable for a particular requirement, such as microprocessor, router, cell phone, etc. An integrated circuit designed for a specific application is known as ASICs (Application Specific Integrated Circuits). Today’s prettly complex ASIC chips is packed with larger pieces of transistors for a specific manufacturing process for the manufacture of integrated circuits in nanometer regime, involving many, many challenges, such as knowledge of various protocols, architectures, models, formats, standards, knowledge of CMOS logic, digital design concepts, EDA tool for taming the region, such as requiring different design, timing, power, heat, noise, routability, lithography consciousness knowledge of variability such as different channel length, Vt, variations in line width, the objective abrreations, IR drop effects, inter-die, intra-die variation, effects and various noise effects such as noise packaging, EMI noise, noise from the mains, crosstalk noise and the ability to test and validate information and to model and characterize all the effects of the initial design phase, measures to increase the yield curve to increase profitability, with short time to market to reduce risks and maximize the predictability and a modular approach to success. Now we dwelve in the “Art of Chip Design” Used a lot of technical jargon, nothing to fear, we will soon. . . Be with me promise that you understand the concepts behind Chip desiging. Before designing a chip? Need Brain Storm 1. What is the market for the chip is scheduled for? 2. What are the protocols involved in the chip? 3. What will be our manufacturing / Architecutes Bus? 4. What is the power / IR-drop / time / area / performance / objectives and how to budget in the chip? 5. What is the process in which the chip will be built? 7. What are the requirements of various third IP / memory? 8. What is our design flow and EDA tools and methodology in question? 9. What is the estimated cost smart? 10. Above all, the bottom line of any business model is money, what will our profit model, the estimation of our ROI (Return on Investment). For the concepts of Chip desiging, Free! Www. vlsichipdesign. comAnalogy Chip Design Architecture Vs Building Architecture Why an analogy with the architecture of buildings, it is fair to understand the concepts of Chip desiging a better way, as we are very familiar with building architecture, then it will be easier for us to chip design architecture. VLSI (very large scale integration) has evolved flow similar to flow involved in the construction of buildings. Now, let us dwelve in the flow of construction in order to better understand the VLSI chip design flow development. Whenever we start to build a building, we have the architecture, how the construction should look like, and all outward appearance, similar to what we will develop an architecture of the chip-design, based on the requirement of the product, which product is addressed, for whom and what to serve the needs, the specification itself, will have the modules. Now go in the implementation of both the building & Chip. We first came up with the plan of the building, so we arrive with the plan of the chip, the basic connectivity / accessibility vaasthu we place our rooms, just as we have constraints placed blocks . As we build the brick building, for Chip Design, we have libraries, which are like pre-designed blocks, for a specific feature. Now try to understand the power structure or the electrical connectivity in our building. Initially, we plan for our electric building, where we have an obligation to all our electrical needs for power. Similar to what we need in power chip, the power required is supplied by the power pads on a ring topology as to have uniform distribution in all corners of the chip and supply must reach all types of cells (bricks to-Chip Design). , This is called topology of power grids in the chip-design, now the requirement is how we design our network-Power, to reduce IR-drop for our standard cell requirement to obtain adequate nutrition. I would not do justice if I did not discuss the clock tree in the flow of chip design. We develop synchronously and asynchronously design (difficult to verify). Most chips monitor synchronously coding, for which the static timing analysis is possible. For the relevance of the flops of the clock to reach those flops along the crystal, in certain objectives through the chip. To do this, a step called clock-tree is performed after the grid is created. Let us try to visualize the concept behind the Place & Route Chip Design. We need to undergo a lot of modeling concepts, understand the process of chip-design. To get a better understanding of the concept of place and route, we assume a society where people who speak different languages are alive, and let us imagine that people speak the same language live in a community, then communication is much easier, much like the chip-design, standard cells that have the design of relations, are placed closer to the flow of investment this concept is known as regioning. Now, in regioning, groups of standard cells, cells that are actually sharing data, placed near by so that the schedule is made and well tuned. This step is called placement, connectivity between the standard cells is known as routing, the challenge is to be optimized or reduced wire lengths. Let us now try to understand the concept behind the integrity of the signal in the chip-design, we often called SI effect. As the process is decreasing day by day, and our silicon realestate is expensive, we try to accommodate more and more standard cells in the restricted area, so that the cells are placed very close, so that the transition one can have an impact on the behavior of others, which may make the path to be faster or slower, this problem is known as signal integrity. Thus, similar in construction to maintain our integrity in the house (near the zone) in the restricted area modurality, we try to create fences, in buildings, so one can think of a concept called the shield, the net high frequency signal with the power of crossing nets. We realize the separation between buildings, similarly, we can make the spacing between the nets, which are in close proximity. To validate the silicon manufacturability issues, the concept of the smart card is Desigining design for test (DFT). One technique is the DFT scan-chain. To understand the concept of chain analysis, we can see that we have an entrance door and an exit door, and a person moves from the entrance and exits from the outlet the rear door of the building, we are sure that there is no blockage in the rooms in the building, to make that person trapped, like that analogy the flip-flops are connected in-seems to create a scan chains and test input values are passed from the scan chain input of the chip and expected data is displayed in the output scan chain of the chip, the chip is assumed to be free from manufacturability problems such as stuck at faults (stuck at one or stuck at zero). For the concepts of Chip desiging, Free! Www. vlsichipdesign. com
Join the Billion Dollar Business – Chip Design Made Easy
Tuesday, March 30th, 2010Introduction The word of the chip design is to build an integrated chip, by integrating billions of transistors to achieve an application. An application can be favorable, a specific requirement such as microprocessors, routers, cell phones, etc. An integrated circuit designed for a specific application is known as ASIC Application (Specific Integrated Circuits). Today’s ASIC Chips prettly complex is packed with larger pieces of transistors for a specific manufacturing process for the manufacture of integrated circuits in a sub nanometer regime, involving many, many challenges, such as knowledge of various protocols, architectures, models, formats, standards, knowledge of logic CMOS Digital Design Concepts, tame the EDA tool for the region as the requirement of differential design, timing, power, temperature, noise, routability, lithography knowledge, knowledge of variability such as different channel length, Vt, variations in line width, lens abrreations, the effects of IR drop, inter-die, intra-die variation, effects and various combinations of sound effects such as noise package, EMI noise, grid noise, noise Cross talk and his ability to test and validate and learn to model and characterize all these effects at the initial stage of the design phase, measures to increase the yield curve to increase profitability, with a short time-to-market to minimize risk and maximize the predictability and a modular approach to success. Now we dwelve yourself to art “Chip Design” Used a lot of technical jargon, no fear, we will soon. . . Be with me promise you understand the concepts behind Chip Desiging. Before designing a chip? Need Brain Storm 1. What the chip market is expected? 2. What are the protocols involved in the chip? 3. What will be our manufacturing / Architecutes Bus? 4. what is the power / IR-drop / time / area / performance / targets and how the budget of the chip? 5. What is the process in which the chip will be built? 7. what are the third different requirements Memory IP /? 8. This is our design flow and EDA tools and methodology in question? 9. What is the estimated cost smart? 10. Above the bottom line of any business model is money, this will be our profit model, estimation of our ROI (Return on Investment). For concepts Chip Desiging, free! Www. vlsichipdesign. comAnalogy Chip Design Architecture Building Vs Why an analogy with the building’s architecture, it is fair to understand the concepts Chip desiging a better way, as we are very familiar with the architecture of the building, then it will be easy for us to chip Architecture Design. VLSI (Very large scale integration) flow has evolved similar to the flow involved in construction. Now, let us dwelve in the flow of construction in order to better understand the design of VLSI chip development cycle. Whenever we begin to construct a building, we have an architecture, how the building should look like, looks outside and all, like the one we will develop an architecture of the chip-design, based on the requirement the product, the product is sent to and used that needs the specification itself, whose modules. Lets go to the party implementation of both the building and Chip. We first came with the floor plan of the building, and we come with the floorplan of the chip, based on connectivity / accessibility / vaasthu we place our rooms, so we have the constraints place the blocks. As we build the brick building for Chip Design, we have libraries, which are like pre-designed blocks for a specific functionality. Now try to understand the power structure or power connectivity in our building. Initially, we plan our building’s electrical, we have a requirement that all our electrical needs to get power. Similar to that we need a smart power, the power required is supplied by the power pads on a ring topology as to have a uniform distribution in all corners of the chip and supply must reach all standard cells (bricks to-Chip Design). It is called as power network topology in Chip-Design, now the requirement is how we design our Power-grid to reduce IR-drop, so that our level of requirement of obtaining cells ‘adequate food. I would not do justice if I did not participate in discussions on the clock and clock-tree in the Chip-Design Flow. We synchronous design and the asynchronous design (hard to verify). The majority of the bulleted follow synchronously coding, for which Static Timing Analysis is possible. For the relevance of flops the clock to those flops should be at the same time from the crystal with an angle with certain objectives in the chip. To do this, a stage known as a clock-tree is performed after power grid is created. Try to visualize the concept behind Place & Route in Chip Design. We need to undergo many modeling concepts, understand the process of design-CHIP. To get a better understanding of the concept of place and route, we assume a society where people who speak different languages are alive, and let us imagine that people speak the same language live in a community, then communication is much easier, even in the so-piece design, standard cells that have the field of ship design, are placed closer to the stream of investment of this concept is known as regioning. Now, in the regioning, groups of standard cells, cells that are actually sharing data, placed close by so there timing is well done and optimized. This step is called placement, connectivity between the standard cell is known as the routing, the challenge is to be optimized and reduced wire length. Let us now try to understand the concept behind the signal integrity in chip-design, we have often wondered IF Effect. As the process is narrowing day by day, and our silicon realestate is expensive, we try to accommodate more and more standard-cells in the limited area, so that the cells are placed in very close proximity, so the transition from one can have an impact on the behavior of others, which may make the journey to be faster or slower, this number is known as signal integrity. So alike in our construction to maintain integrity in the house (near the zone), in the limited area of modurality, we try to create fences, around buildings, so one can think of a concept Shielding known as the net of high frequency signal with the power running through the nets. We make the spacing between buildings, the same way we can make the spacing between the nets, which are in close proximity. To validate the silicon manufacturability issues, the concept in Desigining Chip is design for test (DFT). One technique of DFT is scan-chain. To understand the concept of the chain analysis, we can see that we have a first entry door and a door emergency exit, and a person moves from the entrance and exits from the rear exit door of the building that we are sure that there is no blockage in the rooms in the building, to make that person stuck like this analogy, the flip-flops are connected in-creation seems ‘channel scan and test input values are transmitted from the digital input channel of the chip and the expected data is displayed in the scan-chain output of the chip, then the assumption is the chip is free of problems in manufacturability as stuck faults (stuck at one or stuck at zero). For concepts Chip Desiging, free! Www. vlsichipdesign. com
